Reliability, thermal analysis and optimization wirability design of multi-layer PCB boards

被引：7
|
作者：
Tian, XJ [1 ]
Palusinski, OA [1 ]
机构：
[1] Univ Arizona, Tucson, AZ 85721 USA
来源：
ANNUAL RELIABILITY AND MAINTAINABILITY SYMPOSIUM, 2002 PROCEEDINGS | 2002年
关键词：
PWB; wirability; thermal analysis; optimization;
D O I：
10.1109/RAMS.2002.981673
中图分类号：
TP31 [计算机软件];
学科分类号：
081202 ; 0835 ;
摘要：
This paper provides a comprehensive reliability and thermal analysis of a typical multi-layer printed wire board (PWB) wirability design. Based on some typical values of modem PWB design, numerical solutions are provided for the junction temperature, failure rate, reliability, electrical delay, and cost of typical PWBs. Then, an optimization wirability design procedure is provided by using a weighting method. The major design variable is the number of signal layers in PWB and criteria being considered are the cost, reliability and electrical performance. Monographs are provided for different design parameters.
引用
收藏
页码：392 / 398
页数：7
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