Nitrogen passivation of deposited oxides on n 4H-SiC

被引:23
作者
Chung, GY
Williams, JR
Isaacs-Smith, T
Ren, F
McDonald, K
Feldman, LC
机构
[1] Sterling Semicond Inc, Tampa, FL 33619 USA
[2] Univ Florida, Dept Chem Engn, Gainesville, FL 32611 USA
[3] Auburn Univ, Dept Phys, Auburn, AL 36849 USA
[4] Vanderbilt Univ, Dept Phys & Astron, Nashville, TN 37325 USA
关键词
D O I
10.1063/1.1525058
中图分类号
O59 [应用物理学];
学科分类号
摘要
Results for measurements of interface state density and breakdown field strength are reported for deposited oxides on n 4H-SiC following passivation with nitric oxide. Low-temperature oxides deposited by plasma-enhanced chemical vapor deposition and high-temperature oxides deposited at 950 degreesC were investigated. Nitrogen passivation of deposited oxides on n 4H-SiC is found to produce interface state densities of 1-2x10(12) cm(-2) eV(-1) at E-c-E=0.1 eV, regardless of variations in oxide deposition procedures that affect the residual interfacial carbon concentration. Breakdown field strengths were higher for passivated high-temperature oxides compared to passivated low-temperature oxides at room temperature and 290 degreesC. We suggest that additional oxide growth during the NO passivation is the reason for the observed interface state densities. (C) 2002 American Institute of Physics.
引用
收藏
页码:4266 / 4268
页数:3
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