Arrayed SU-8 polymer thermal actuators with inherent real-time feedback for actively modifying MEMS' substrate warpage

被引:0
作者
Wang, Xinghua [1 ]
Xiao, Dingbang [1 ,2 ]
Chen, Zhihua [1 ,2 ]
Wu, Xuezhong [1 ,2 ]
机构
[1] Natl Univ Def Technol, Coll Mechatron Engn & Automat, Changsha 410073, Hunan, Peoples R China
[2] Natl Univ Def Technol, Lab Sci & Technol Integrated Logist Support, Changsha 410073, Hunan, Peoples R China
基金
中国国家自然科学基金;
关键词
SU-8; array; thermal actuator; MEMS; warpage; feedback; DEFORMABLE MIRROR; FABRICATION; STRESS; GYROSCOPES; PACKAGE; SENSORS;
D O I
10.1088/0960-1317/26/9/095011
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper describes the design, fabrication and characterization of a batch-fabricated micro-thermal actuators array with inherent real-time self-feedback, which can be used to actively modify micro-electro-mechanical systems' (MEMS') substrate warpage. Arrayed polymer thermal actuators utilize SU-8 polymer (a thick negative photoresist) as a functional material with integrated Ti/Al film-heaters as a microscale heat source. The electro-thermo-mechanical response of a micro-fabricated actuator was measured. The resistance of the Al/Ti film resistor varies obviously with ambient temperature, which can be used as inherent feedback for observing real-time displacement of activated SU-8 bumps (0.43 mu m Omega(-1)). Due to the high thermal expansion coefficient, SU-8 bumps tend to have relatively large deflection at low driving voltage and are very easily integrated with MEMS devices. Experimental results indicated that the proposed SU-8 polymer thermal actuators (array) are able to achieve accurate rectification of MEMS' substrate warpage, which might find potential applications for solving stress-induced problems in MEMS.
引用
收藏
页数:10
相关论文
共 33 条
[1]  
[Anonymous], 1998, Handbook of Chemistry and Physics
[2]   Control Scheme to Reduce the Effect of Structural Imperfections in a Rate Integrating MEMS Gyroscope [J].
Bowles, Stephen R. ;
Gallacher, Barry J. ;
Hu, Zhong Xu ;
Fell, Christopher P. ;
Townsend, Kevin .
IEEE SENSORS JOURNAL, 2015, 15 (01) :552-560
[3]  
Bulcke MV, 2003, EL PACKAG TECH CONF, P380
[4]   Simulations for thermal warpage and pressure nonlinearity of monolithic CMOS pressure sensors [J].
Chiou, JA .
IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2003, 26 (03) :327-333
[5]   SU-8: a photoresist for high-aspect-ratio and 3D submicron lithography [J].
del Campo, A. ;
Greiner, C. .
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2007, 17 (06) :R81-R95
[6]   Characterization of frequency tuning using focused ion beam platinum deposition [J].
Enderling, Stefan ;
Hedley, John ;
Jiang, Liudi ;
Cheung, Rebecca ;
Zorman, Christian ;
Mehregany, Mehran ;
Walton, Anthony J. .
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2007, 17 (02) :213-219
[7]   An investigation of microscale explosive vaporization of water on an ultrathin Pt wire [J].
Glod, S ;
Poulikakos, D ;
Zhao, Z ;
Yadigaroglu, G .
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2002, 45 (02) :367-379
[8]   Theoretical and experimental study of capacitance considering fabrication process and edge effect for MEMS comb actuator [J].
Guo Zhanshe ;
Feng Zhou ;
Cao Le ;
Fan Shangchun .
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2011, 17 (01) :71-76
[9]   Transition interface for improving the temperature characteristics of micromachined gyroscopes [J].
Hou, Zhanqiang ;
Wu, Xuezhong ;
Xiao, Dingbang ;
Chen, Zhihua ;
Su, Jianbin .
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2014, 20 (02) :227-234
[10]   Gradient residual stress induced elastic deformation of multilayer MEMS structures [J].
Huang, Shusen ;
Zhang, Xin .
SENSORS AND ACTUATORS A-PHYSICAL, 2007, 134 (01) :177-185