A new class of distributed space missions is emerging which requires hundreds to thousands of satellites for real-time, distributed, multi-point sensing to accomplish long-awaited remote sensing and science objectives. These missions, stymied by the lack of a low-cost mass-producible solution, can become reality by merging the concepts of distributed satellite systems and terrestrial wireless sensor networks. However, unlike terrestrial sensor nodes, space-based nodes must survive unique environmental hazards while undergoing complex orbital dynamics. A novel sub-kilogram very small satellite design is needed to meet these requirements. Sub-kilogram satellite concepts are developing elsewhere, such as traditional picosatellites and microengineered aerospace systems. Although viable technical solutions, these technologies currently come at a high cost due to their reliance on high-density technology or custom manufacturing processes. While evaluating these technologies, two untapped technology areas became evident that uniquely encompass low cost and mass producibility by leveraging existing commercial production techniques: satellite-on-a-chip (SpaceChip) and satellite-on-a-printed circuit board (PCBSat). This paper focuses on the design, build, and test results of a prototype PCBSat with a prototype unit cost less than $300. The paper concludes with mission applications and future direction. Published by Elsevier Ltd.
