Development of new low stress epoxies for MEMS device encapsulation

被引：7

作者：

Wu, JL ^{[1
]}

Wong, CP ^{[1
]}

机构：

[1] Georgia Inst Technol, Sch Mat Sci & Engn, Packaging Res Ctr, Atlanta, GA 30332 USA

来源：

IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | 2002年 / 25卷 / 02期

关键词：

contamination resistance; low stress epoxies; microelectromechanical systems (MEMS); toughness;

D O I：

10.1109/TCAPT.2002.1010018

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In this study, a series of new low stress epoxies was introduced as conformal encapsulants, which show a high promise to meet all the requirements for the protection of the pressure sensor system. Mechanical properties such as initial Young's modulus, toughness and ultimate tensile stress were evaluated. The more critical issue of material's contamination resistance to the jet fuel was improved. And the mechanism behind materials low stress and toughness behaviors was investigated from the viewpoint of microstructure.

引用

页码：278 / 282

页数：5

共 9 条

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