Shear Strength and Aging Characteristics of Sn-3.0Ag-0.5Cu/Cu Solder Joint Reinforced with ZrO2 Nanoparticles

被引：26
作者：
Rajendran, Sri Harini [1 ]
Hwang, Seung Jun [1 ]
Jung, Jae Pil [1 ]
机构：
[1] Univ Seoul, Dept Mat Sci & Engn, 163 Seoulsiripdae Ro, Seoul 02504, South Korea
来源：
METALS | 2020年 / 10卷 / 10期
关键词：
nanocomposite solder; Ag3Sn intermetallic compound; aging; shear strength; MECHANICAL-PROPERTIES; MICROSTRUCTURE EVOLUTION; TIO2; NANOPARTICLES; FRACTURE-BEHAVIOR; MICROHARDNESS; TEMPERATURE; ADDITIONS; GROWTH; ALLOY;
D O I：
10.3390/met10101295
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
This study investigates the shear strength and aging characteristics of Sn-3.0Ag-0.5Cu (SAC 305)/Cu joints by the addition of ZrO2 nanoparticles (NPs) having two different particle size: 5-15 nm (ZrO(2)A) and 70-90 nm (ZrO2B). Nanocomposite pastes were fabricated by mechanically mixing ZrO2 NPs and the solder paste. ZrO2 NPs decreased the beta-Sn grain size and Ag3Sn intermetallic compound (IMC) in the matrix and reduced the Cu6Sn5 IMC thickness at the interface of lap shear SAC 305/Cu joints. The effect is pronounced for ZrO(2)A NPs added solder joint. The solder joints were isothermally aged at 175 degrees C for 24, 48, 144 and 256 h. NPs decreased the diffusion coefficient from 1.74 x 10(-16) m/s to 3.83 x 10(-17) m/s and 4.99 x 10(-17) m/s for ZrO(2)A and ZrO2B NPs added SAC 305/Cu joints respectively. The shear strength of the solder joints decreased with the aging time due to an increase in the thickness of interfacial IMC and coarsening of Ag3Sn in the solder. However, higher shear strength exhibited by SAC 305-ZrO(2)A/Cu joints was attributed to the fine Ag3Sn IMC's dispersed in the solder matrix. Fracture analysis of SAC 305-ZrO(2)A/Cu joints displayed mixed solder/IMC mode upon 256 h of aging.
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页码：1 / 17
页数：17
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