The thermal property of lead-free Sn-8.55Zn-1Ag-XAI solder alloys and their wetting interaction with Cu

被引：48

作者：

Cheng, SC ^{[1
]}

Lin, KL ^{[1
]}

机构：

[1] Natl Cheng Kung Univ, Dept Mat Sci & Engn, Tainan 70101, Taiwan

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2002年 / 31卷 / 09期

关键词：

wettability; lead-free solder; Sn-Zn; solidus temperature; liquidus temperature; wetting force; wetting time; intermetallics;

D O I：

10.1007/s11664-002-0187-3

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The wetting behaviors between the quaternary Sn-8.55Zn-1Ag-XAl solder alloys and Cu have been investigated with the wetting balance method. The Al contents, x, of the quaternary solder alloys investigated were 0.01-0.45 wt.%. The results of differential scanning calorimeter (DSC) analysis indicate that the solders exhibit a solid-liquid coexisting range of about 7-10degreesC. The solidus temperature of the quaternary Sn-8.55Zn-1Ag-XAl solder alloys is about 198.2degreesC, while the liquidus temperatures are 205-207degreesC. The experimental results showed that the wettability of the Sn-8.55Zn-1Ag-XAl solder alloys is improved by the addition of Al. The mean maximum wetting force of the solders with Cu is within 0.75-1.18 mN and the mean wetting time is around 1.0-1.1 sec, better than the similar to1.3 sec of eutectic Sn-9Zn and Sn-8.55Zn-1Ag solder alloys. The addition of Al also depresses the formation of epsilon-Ag-Zn compounds at the interface between Sn-8.55Zn-1Ag-XAl solders and copper.

引用

页码：940 / 945

页数：6

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