Polyimide multi-layer substrate for high-density semiconductor package

被引：0

作者：

Takenaka, Shoichi ^{[1
]}

Kishihara, Ryoichi ^{[1
]}

Okamoto, Masahiro ^{[1
]}

Ito, Shoji ^{[1
]}

Nakao, Osamu ^{[1
]}

机构：

[1] Fujikura Ltd, Circuit Technol R&D Dept, Sakura, Chiba 2858550, Japan

来源：

Advances in Electronic Packaging 2005, Pts A-C | 2005年

关键词：

polyimide; multi-layer substrate; interstitial via hole; conductive paste;

D O I：

10.1115/IPACK2005-73065

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

We have developed a polyimide multi-layer substrate for semiconductor package. Interstitial via holes filled with conductive paste make the electrical connection in any layers in the multi-layer substrate to realize high-density wiring. The substrate shows reliable resistance to moisture and heat. Use of polyimide film make the substrate considerable thin compared to the conventional method using glass-epoxy. The present multi-layer substrate can be applied to a promising interposer for high-density semiconductor such as multi-chip module and stacked chip.

引用

页码：1779 / 1782

页数：4

共 20 条

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