Dynamic recrystallization at triple junction during high-temperature deformation in copper tricrystal

被引：6

作者：

Andiarwanto, S ^{[1
]}

Miura, H ^{[1
]}

Sakai, T ^{[1
]}

机构：

[1] Univ Electrocommun, Dept Mech Engn & Intelligent Syst, Chofu, Tokyo 1828585, Japan

来源：

TEXTURES OF MATERIALS, PTS 1 AND 2 | 2002年 / 408-4卷

关键词：

copper; dynamic recrystallization; high temperature; tensile deformation; tricrystal; triple junctions;

D O I：

10.4028/www.scientific.net/MSF.408-412.761

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Dynamic recrystallization (DRX) at triple junction in copper tricrystal was investigated during high-temperature tensile deformation. DRX nucleation occurred preferentially at triple junction at lower strain than the peak strain (about 2/3). Preferential occurrence of DRX nucleation at triple junction is considered as a result of stress and deformation concentration. Most of DRX grains were twin. DRX nucleation process at the triple function was discussed in relation to grain-boundary sliding, fold formation and grain-boundary migration.

引用

页码：761 / 766

页数：6

共 9 条

[1]

[Anonymous], RECRYSTALLIZATION RE

[2] EFFECT OF INITIAL GRAIN-SIZE ON DYNAMIC RECRYSTALLIZATION OF COPPER [J].

BLAZ, L ;

SAKAI, T ;

JONAS, JJ .

METAL SCIENCE, 1983, 17 (12) :609-616

[3] Finite element analysis about effects of stiffness distribution on stresses and elastic strain energy near the triple junction in a tricrystal [J].

Chen, CR ;

Li, SX ;

Wen, JL ;

Jia, WP .

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2000, 282 (1-2) :170-176

[4] Formation of annealing twins in f.c.c. crystals [J].

Mahajan, S ;

Pande, CS ;

Imam, MA ;

Rath, BB .

ACTA MATERIALIA, 1997, 45 (06) :2633-2638

[5] EFFECT OF GRAIN-BOUNDARY MISORIENTATION ON DYNAMIC RECRYSTALLIZATION OF CU-SI BICRYSTALS [J].

MIURA, H ;

AOYAMA, H ;

SAKAI, T .

JOURNAL OF THE JAPAN INSTITUTE OF METALS, 1994, 58 (03) :267-275

[6]

MIURA H, IN PRESS MAT T

[7]

MIURA H, 2001, P 1 INT C REX GRAIN

[8] THE EFFECT OF TRIPLE JUNCTION TYPE ON GRAIN-BOUNDARY SLIDING AND ACCOMMODATION IN ALUMINUM TRICRYSTALS [J].

SISANBAEV, AV ;

VALIEV, RZ .

ACTA METALLURGICA ET MATERIALIA, 1992, 40 (12) :3349-3356

[9]

TAKAHASHI T, 1993, P 7 JIM INT S ASP HI, P131

← 1 →