Dynamic recrystallization at triple junction during high-temperature deformation in copper tricrystal

被引：6
作者：
Andiarwanto, S [1 ]
Miura, H [1 ]
Sakai, T [1 ]
机构：
[1] Univ Electrocommun, Dept Mech Engn & Intelligent Syst, Chofu, Tokyo 1828585, Japan
来源：
TEXTURES OF MATERIALS, PTS 1 AND 2 | 2002年 / 408-4卷
关键词：
copper; dynamic recrystallization; high temperature; tensile deformation; tricrystal; triple junctions;
D O I：
10.4028/www.scientific.net/MSF.408-412.761
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Dynamic recrystallization (DRX) at triple junction in copper tricrystal was investigated during high-temperature tensile deformation. DRX nucleation occurred preferentially at triple junction at lower strain than the peak strain (about 2/3). Preferential occurrence of DRX nucleation at triple junction is considered as a result of stress and deformation concentration. Most of DRX grains were twin. DRX nucleation process at the triple function was discussed in relation to grain-boundary sliding, fold formation and grain-boundary migration.
引用
收藏
页码：761 / 766
页数：6
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