Innovative stack-die package - S2BGA

被引:5
作者
Wu, L [1 ]
Wang, YP [1 ]
Hsiao, CS [1 ]
机构
[1] Siliconware Precis Ind Co Ltd, Taichung, Taiwan
来源
52ND ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2002 PROCEEDINGS | 2002年
关键词
D O I
10.1109/ECTC.2002.1008102
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Stack-die package concept has been emerging 2similar to3 years ago. The major product - stack-die package with Flash and SRAM chips integrated together which is driven by cellular phone for the purpose of size and weight reduction. The basic requirement for these two dies in stacked package is the size difference must be large enough to allow wire bonding process at bottom die if we still want to utilize the low cost, mature wire bonding technology in interconnection. However, this requirement will limit the application in trying to integrate two similar or same size dies into one stack-die package. One solution for this application is to utilize flip chip technology in interconnection to solve the die size difference requirement. One of concerns for this package is the higher assembly cost due to Flip Chip interconnection. Therefore, a low cost, high reliability alternative package structure is created, it is named S2BGA as Fig. 1.(Spacer Stacked Ball Grid Array).
引用
收藏
页码:250 / 253
页数:2
相关论文
共 5 条
[1]  
FUKUI Y, 50 ECTC 2000
[2]  
HSIEH R, 2001, S2BGA DESIGN RULE ST
[3]  
INTEL, Patent No. 5815372
[4]  
WU L, SPIL S2BGA SPIL INTE
[5]  
WU L, PACCOM 2000