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Low-Power, Intelligent, and Secure Solutions for Realization of Internet of Things
被引:18
作者
:
Chen, Yen-Kuang
论文数:
0
引用数:
0
h-index:
0
机构:
Intel Corp, Intel Labs, Santa Clara, CA 95054 USA
Intel Corp, Intel Labs, Santa Clara, CA 95054 USA
Chen, Yen-Kuang
[
1
]
Wu, An-Yeu
论文数:
0
引用数:
0
h-index:
0
机构:
Natl Taiwan Univ, Dept Elect Engn, Taipei 106, Taiwan
Intel Corp, Intel Labs, Santa Clara, CA 95054 USA
Wu, An-Yeu
[
2
]
Bayoumi, Magdy A.
论文数:
0
引用数:
0
h-index:
0
机构:
Univ Louisiana, Ctr Adv Comp Studies, Lafayette, LA 70503 USA
Intel Corp, Intel Labs, Santa Clara, CA 95054 USA
Bayoumi, Magdy A.
[
3
]
Koushanfar, Farinaz
论文数:
0
引用数:
0
h-index:
0
机构:
Rice Univ, Dept Elect & Comp Engn, Houston, TX 77251 USA
Intel Corp, Intel Labs, Santa Clara, CA 95054 USA
Koushanfar, Farinaz
[
4
]
机构
:
[1]
Intel Corp, Intel Labs, Santa Clara, CA 95054 USA
[2]
Natl Taiwan Univ, Dept Elect Engn, Taipei 106, Taiwan
[3]
Univ Louisiana, Ctr Adv Comp Studies, Lafayette, LA 70503 USA
[4]
Rice Univ, Dept Elect & Comp Engn, Houston, TX 77251 USA
来源
:
IEEE JOURNAL ON EMERGING AND SELECTED TOPICS IN CIRCUITS AND SYSTEMS
|
2013年
/ 3卷
/ 01期
关键词
:
Internet of things;
D O I
:
10.1109/JETCAS.2013.2244771
中图分类号
:
TM [电工技术];
TN [电子技术、通信技术];
学科分类号
:
0808 ;
0809 ;
摘要
:
This special issue aims to provide a timely discussion on the technical trends and challenges of circuits and systems on Internet of Things (IoT). Rapid advancement of networking technologies together with extreme miniaturization of computing and communication devices enable emerging and exciting applications and services that connect the cyber and physical worlds. In the future, digital sensing, communication, and processing capabilities will be ubiquitously embedded into everyday objects, turning them into the IoT. In this new paradigm, smart devices will collect data, relay the information or context to each other, and process the information collaboratively in a machine-to-machine (M2M) manner. © 2011 IEEE.
引用
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页码:1 / 4
页数:4
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