Fatigue crack growth in micro-machined single-crystal silicon

被引:16
|
作者
Renuart, ED
Fitzgerald, AM
Kenny, TW
Dauskardt, RH [1 ]
机构
[1] Stanford Univ, Dept Mat Sci & Engn, Stanford, CA 94305 USA
[2] Stanford Univ, Dept Aeronaut & Astronaut, Stanford, CA 94305 USA
[3] Stanford Univ, Dept Mech Engn, Stanford, CA 94305 USA
基金
美国国家科学基金会;
关键词
D O I
10.1557/JMR.2004.0343
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Although crystalline silicon is not generally considered susceptible to fatigue crack growth, recent studies suggest that there may be fatigue processes in silicon micro-machined structures. In the present study, a micro-machined fracture specimen geometry was used to examine stable crack growth under fatigue loading. Crack length and loads were carefully monitored throughout the test to distinguish between environmentally assisted crack growth (stress corrosion) and mechanically induced fatigue-crack growth. Results revealed similar steplike crack extension versus time for the cyclic and monotonic tests. The fatigue crack-growth curve extracted from the crack extension data exhibited a nearly vertical slope with no evidence of accelerated crack-growth rates. Fracture surfaces for the monotonic and cyclic tests were similar, further suggesting that a true mechanical fatigue crack-growth mechanism did not occur. Explanations for the observed lack of fatigue crack growth are presented and discussed with respect to reported stress-life behavior.
引用
收藏
页码:2635 / 2640
页数:6
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