Thermal stability of electrodeposited nanocrystalline nickel assisted by flexible friction

被引：12

作者：

Lue, Biao ^{[1
,2
]}

Hu, Zhen-feng ^{[3
]}

Wang, Xiao-he ^{[2
]}

Xu, Bin-shi ^{[2
]}

机构：

[1] Northeastern Univ, Sch Met & Mat, Shenyang 110819, Peoples R China

[2] Acad Armored Forces Engn, Natl Key Lab Remfg, Beijing 100072, Peoples R China

[3] Acad Armored Forces Engn, Natl Engn Res Ctr Mech Prod Remfg, Beijing 100072, Peoples R China

来源：

TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA | 2015年 / 25卷 / 10期

基金：

中国国家自然科学基金;

关键词：

electrodeposition; nanocrystalline nickel; flexible friction; thermal stability; grain growth; GRAIN-GROWTH; BEHAVIOR;

D O I：

10.1016/S1003-6326(15)63967-X

中图分类号：

TF [冶金工业];

学科分类号：

0806 ;

摘要：

Nanocrystalline nickel coating was prepared by flexible friction assisted electrodeposition technology in an additive-free Watts bath. The coating consists of massive equiaxial crystals with an average grain size of about 24 nm and exhibits a (111) preferred orientation. The differential scanning calorimetry (DSC) analysis of nanocrystalline nickel demonstrates that the peak temperature of rapid grain growth is about 285.4 degrees C, and the peak temperature of grain growth towards equilibrium is around 431.5 degrees C. The isochronous annealing results reveal that abnormal grain growth behavior is not observed in nanocrystalline nickel without sulfur-containing. The thermal stability of the deposition was improved due to its initial microstructure of the as-deposited nickel and a certain amount of annealing nano-twins with low-energy, which reduces the driving force for grain growth. Consequently, the coating shows a low residual tensile stress of about 50 MPa and a high microhardness of HV 400 at the annealing temperature of 450 degrees C.

引用

页码：3297 / 3304

页数：8

共 28 条

[1] Investigation of low temperature thermal stability in bulk nanocrystalline Ni [J].

Chauhan, Manish ;

Mohamed, Farghalli A. .

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2006, 427 (1-2) :7-15

[2] Controlling the thermal stability of texture in single-phase electrodeposits [J].

Czerwinski, F ;

Szpunar, JA .

NANOSTRUCTURED MATERIALS, 1999, 11 (05) :669-676

[3] Nanocrystalline electrodeposited Ni: microstructure and tensile properties [J].

Dalla Torre, F ;

Van Swygenhoven, H ;

Victoria, M .

ACTA MATERIALIA, 2002, 50 (15) :3957-3970

[4] Growth of abnormal planar faceted grains in nanocrystalline nickel containing impurity sulphur [J].

Darnbrough, J. E. ;

Flewitt, P. E. J. .

ACTA MATERIALIA, 2014, 79 :421-433

[5] The effect of substrate on the microstructure and tensile properties of electrodeposited nanocrystalline nickel [J].

Ebrahimi, F ;

Ahmed, Z .

MATERIALS CHARACTERIZATION, 2002, 49 (05) :373-379

[6] ELECTRODEPOSITED NANOCRYSTALS - SYNTHESIS, STRUCTURE, PROPERTIES AND FUTURE APPLICATIONS [J].

ERB, U .

CANADIAN METALLURGICAL QUARTERLY, 1995, 34 (03) :275-280

[7] Characterization of electrodeposited nickel coatings from sulphamate electrolyte without additive [J].

Godon, A. ;

Creus, J. ;

Feaugas, X. ;

Conforto, E. ;

Pichon, L. ;

Armand, C. ;

Savall, C. .

MATERIALS CHARACTERIZATION, 2011, 62 (02) :164-173

[8] Effects of grain orientation on the Hall-Petch relationship in electrodeposited nickel with nanocrystalline grains [J].

Godon, A. ;

Creus, J. ;

Cohendoz, S. ;

Conforto, E. ;

Feaugas, X. ;

Girault, P. ;

Savall, C. .

SCRIPTA MATERIALIA, 2010, 62 (06) :403-406

[9] Grain size effects on the fatigue response of nanocrystalline metals [J].

Hanlon, T ;

Kwon, YN ;

Suresh, S .

SCRIPTA MATERIALIA, 2003, 49 (07) :675-680

[10] Thermal stability of nanostructured electrodeposits [J].

Hibbard, G ;

Erb, U ;

Aust, KT ;

Klement, U ;

Palumbo, G .

METASTABLE, MECHANICALLY ALLOYED AND NANOCRYSTALLINE MATERIALS, 2002, 386-3 :387-396

← 1 2 3 →