Influences of in situ annealing on microstructure, residual stress and electrical resistivity for sputter-deposited Be coating

被引:19
作者
Luo, B. C. [1 ,2 ]
Li, K. [1 ]
Tan, X. L. [1 ,2 ]
Zhang, J. Q. [1 ]
Luo, J. S. [1 ]
Jiang, X. D. [1 ]
Wu, W. D. [1 ]
Tang, Y. J. [1 ]
机构
[1] China Acad Engn Phys, Res Ctr Laser Fus, Mianyang 621900, Peoples R China
[2] Sci & Technol Plasma Phys Lab, Mianyang 621900, Peoples R China
基金
中国国家自然科学基金;
关键词
Beryllium coating; Residual stress; Surface roughness; Grain boundary; Electrical resistivity; ISLAND COALESCENCE; NIF; EVOLUTION; TARGETS; SURFACE; GROWTH; UPDATE; STATE;
D O I
10.1016/j.jallcom.2014.03.128
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
The Be coating grown on K9 substrate are fabricated at different annealing temperatures by dc magnetron sputtering, and they are composed of alpha-Be phase with hcp structure from XRD analysis. As the in situ annealing temperatures increase from 60 degrees C to 410 degrees C, the coating surfaces show the transition from fibrous grains dominated by surface diffusion to diamond-like grains, and then to recrystallized grains dominated by bulk diffusion. For the coating cross-section morphologies, they are always characterized by the coarsening columnar grains with distinct boundaries. Both surface roughness and grain size increase with annealing temperatures, and obey the modified Anelli model. Moreover, the constitutive relationship of Be coating was explored. The residual stress is related closely to the microstructures and annealing temperatures, not only displays the tensile stress but also compressive stress. The compression- tension transition temperature occurs near 250 degrees C (0.34Tm), which is just recrystallization transition temperature. The film electrical resistivity values decrease gradually with the increase of grain size due to the reduction of grain boundary. (C) 2014 Elsevier B.V. All rights reserved.
引用
收藏
页码:150 / 156
页数:7
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