Online Junction Temperature Estimation of SiC Power MOSFETS Through On-State Voltage Mapping

被引:101
作者
Stella, Fausto [1 ]
Pellegrino, Gianmario [1 ]
Armando, Eric [1 ]
Dapra, Davide [2 ]
机构
[1] Politecn Torino, Dipartimento Energia, I-10129 Turin, Italy
[2] Vishay Semicond Italiana SpA, I-10071 Turin, Italy
关键词
Junction temperature monitoring; on-state resistance; on-state voltage; silicon carbide (SiC) power MOSFET; thermo-sensitive electrical parameters (TSEP); ACTIVE THERMAL CONTROL; RELIABILITY;
D O I
10.1109/TIA.2018.2812710
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This paper dealswith real-time estimation of the junction temperature of SiC power MOSFETs. The junction temperature of a device with four-switch module is estimated in real-time by measuring its current and on-state voltage VON at each switching period and entering the temperature in the lookup table of the device. The temperature model is preliminarily obtained in a dedicated commissioning session, where VON is measured at different temperature and current conditions. The results show the feasibility of online temperature monitoring and even the active limitation of the junction temperature of the tested SiC power MOSFET modules accurately and with an instantaneous dynamic response. Different modules with die from different manufacturers were tested in an H-bridge demonstrator power converter, emulating the operating conditions of real converters such as voltage source dc/ac or dc/dc conversion structures. The commissioning procedure is meant to be performed directly on the final application for each converter. The measurements obtained using the proposed temperature estimation technique are validated using a thermal camera and compared to the direct measurement of the die temperature with a thermistor, showing high accuracy and high feasibility.
引用
收藏
页码:3453 / 3462
页数:10
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