Magnetic force microscopy measurement of current on integrated circuits

被引:0
|
作者
Pu, A [1 ]
Rahman, A [1 ]
Thomson, DJ [1 ]
Bridges, GE [1 ]
机构
[1] Univ Manitoba, Dept Elect & Comp Engn, Winnipeg, MB R3T 5V6, Canada
来源
IEEE CCEC 2002: CANADIAN CONFERENCE ON ELECTRCIAL AND COMPUTER ENGINEERING, VOLS 1-3, CONFERENCE PROCEEDINGS | 2002年
关键词
MFM; fault location; failure analysis;
D O I
暂无
中图分类号
TP18 [人工智能理论];
学科分类号
081104 ; 0812 ; 0835 ; 1405 ;
摘要
In IC failure analysis current is often used to indicate the presence of a defective device. By imaging the magnetic field produced by current flowing in an IC the defective devices can be located. In this paper we will present experimental results on imaging current carrying lines on integrated circuits using MFM. We have experimentally determined that MFM is capable of measuring out-rents as small as 1muAsimilar to10muA on ICs. We have also carried out simulations comparing MFM imaging with experimental results. Using these simulations we have devised a method to locate accurately the position of the internal current carrying faults from MFM images. This technique has significant potential for IC fault location and other IC failure analysis applications.
引用
收藏
页码:439 / 444
页数:4
相关论文
共 50 条
  • [1] Location of current carrying faults in integrated circuits by magnetic force microscopy
    Pu, A
    Rahman, A
    Thomson, DJ
    Bridges, GE
    SPATIALLY RESOLVED CHARACTERIZATION OF LOCAL PHENOMENA IN MATERIALS AND NANOSTRUCTURES, 2003, 738 : 387 - 393
  • [2] Location of current carrying failure sites in integrated circuits by magnetic force microscopy at large probe-to-sample separation
    Pu, A.
    Thomson, D. J.
    Bridges, G. E.
    MICROELECTRONIC ENGINEERING, 2009, 86 (01) : 16 - 23
  • [3] Calibrated magnetic force microscopy measurement of current-carrying lines
    Yongsunthon, R
    McCoy, J
    Williams, ED
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2001, 19 (04): : 1763 - 1768
  • [4] Diagnosis in submicron integrated circuits by electric force microscopy
    Bohm, C
    Sprengepiel, J
    Kubalek, E
    MICROELECTRONICS AND RELIABILITY, 1996, 36 (7-8): : 1113 - 1118
  • [5] Electrical characterization of integrated circuits by scanning force microscopy
    Bohm, C.
    Roths, C.
    Muller, U.
    Beyer, A.
    Kubalek, E.
    Materials science & engineering. B, Solid-state materials for advanced technology, 1994, B24 (1-3): : 218 - 222
  • [6] Magnetic Force Microscopy for Diagnosis of Complex Superconducting Circuits
    Grebenchuk, S. Yu.
    Hovhannisyan, R. A.
    Shishkin, A. G.
    Dremov, V. V.
    Stolyarov, V. S.
    PHYSICAL REVIEW APPLIED, 2022, 18 (05)
  • [7] Voltage contrast in submicron integrated circuits by scanning force microscopy
    Bohm, C
    Sprengepiel, J
    Otterbeck, M
    Kubalek, E
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1996, 14 (02): : 842 - 844
  • [8] ELECTRICAL CHARACTERIZATION OF INTEGRATED-CIRCUITS BY SCANNING FORCE MICROSCOPY
    BOHM, C
    ROTHS, C
    MULLER, U
    BEYER, A
    KUBALEK, E
    MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, 1994, 24 (1-3): : 218 - 222
  • [9] SAMPLED WAVE-FORM MEASUREMENT IN INTEGRATED-CIRCUITS USING HETERODYNE ELECTROSTATIC FORCE MICROSCOPY
    BRIDGES, GE
    SAID, RA
    MITTAL, M
    THOMSON, DJ
    REVIEW OF SCIENTIFIC INSTRUMENTS, 1994, 65 (11): : 3378 - 3381
  • [10] Magnetic Tunnel Junction (MTJ) Sensors for Integrated Circuits (IC) Electric Current Measurement
    Cubells, M. D.
    Reig, C.
    De Marcellis, A.
    Roldan, A.
    Roldan, J. -B.
    Cardoso, S.
    Freitas, P. P.
    2013 IEEE SENSORS, 2013, : 379 - 382