High-voltage SiC pn diodes with avalanche breakdown fabricated by aluminum or boron ion implantation

被引:4
作者
Negoro, Y [1 ]
Miyamoto, N [1 ]
Kimoto, T [1 ]
Matsunami, H [1 ]
机构
[1] Kyoto Univ, Dept Elect Sci & Engn, Sakyo Ku, Kyoto 6068501, Japan
来源
SILICON CARBIDE AND RELATED MATERIALS 2001, PTS 1 AND 2, PROCEEDINGS | 2002年 / 389-3卷
关键词
avalanche breakdown; ion implantation; pn diodes;
D O I
10.4028/www.scientific.net/MSF.389-393.1273
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Aluminum ion (Al+) and boron ion (B+) implantation into 4H-SiC and the characteristics of implanted pn junctions have been investigated. Three groups of diodes with planar structures were fabricated by employing Al+ and B+ implantation. A SiC pn diode fabricated by shallow Al+ and deep B+ implantations has exhibited a high breakdown voltage of 2900 V with a low on-resistance of 8.0 mOmegacm(2) at room temperature. The diodes fabricated in this study showed a positive temperature coefficient of breakdown voltage.
引用
收藏
页码:1273 / 1276
页数:4
相关论文
共 8 条
[1]   A novel diffusion resistant P-base region implantation for accumulation mode 4H-SiC epi-channel field effect transistor [J].
Kumar, R ;
Kozima, J ;
Yamamoto, T .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2000, 39 (4B) :2001-2007
[2]   Switching behaviour of fast high voltage SiC pn-diodes [J].
Mitlehner, H ;
Friedrichs, P ;
Peters, D ;
Schorner, R ;
Weinert, U ;
Weis, B ;
Stephani, D .
ISPSD '98 - PROCEEDINGS OF THE 10TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES & ICS, 1998, :127-130
[3]   SiC device technology: remaining issues [J].
Palmour, JW ;
Lipkin, LA ;
Singh, R ;
Slater, DB ;
Suvorov, AV ;
Carter, CH .
DIAMOND AND RELATED MATERIALS, 1997, 6 (10) :1400-1404
[4]  
Pensl G, 1996, INST PHYS CONF SER, V142, P275
[5]   SiC power devices for high voltage applications [J].
Rottner, K ;
Frischholz, M ;
Myrtveit, T ;
Mou, D ;
Nordgren, K ;
Henry, A ;
Hallin, C ;
Gustafsson, U ;
Schöner, A .
MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, 1999, 61-2 :330-338
[6]  
Troffer T, 1997, PHYS STATUS SOLIDI A, V162, P277, DOI 10.1002/1521-396X(199707)162:1<277::AID-PSSA277>3.0.CO
[7]  
2-C
[8]   Effects of wet oxidation/anneal on interface properties of thermally oxidized SiO2/SiC MOS system and MOSFET's [J].
Yano, H ;
Katafuchi, F ;
Kimoto, T ;
Matsunami, H .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1999, 46 (03) :504-510