Dynamic Mechanical Properties and Thermal Effect of an Epoxy Resin Composite, Encapsulation's Element of a New Electronic Component

Epoxy resin is used in many industrial applications principally in the microelectronic field to protect integrated circuits. However, these components are subject to various environments such as moisture and thermal fluctuations during packaging. Consequently, mechanical, physical and chemical properties of the resin can be affected. For an epoxy resin composite designed for a future application, an evaluation of the relevant properties was carried out using a dynamic mechanical analyzer and a thermogravimetric analysis (TGA) instrument. The surface morphology was investigated using scanning electron microscopy to examine the impact of post-cured treatment through evolution of the rigidity and of the glass transition temperature. Subsequently, a temperature classification was proposed to define the temperature limit for safe use of the material. Finally, temperature degradation was observed and confirmed by TGA tests. Results from all of these analyses bring understanding to the phenomenon of thermal degradation and its influence on the stability of the epoxy resin composite.