Staggered heat sinks with aerodynamic cooling fins

被引:19
作者
Leon, OA
De Mey, G
Dick, E
Vierendeels, J
机构
[1] Univ Ghent, Dept Flow Heat & Combust Mech, B-9000 Ghent, Belgium
[2] Univ Ghent, Dept Elect & Informat Syst, B-9000 Ghent, Belgium
关键词
aerodynamic cooling fins; staggered cooling fins; heat sink optimization;
D O I
10.1016/j.microrel.2004.03.003
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The effect of aerodynamic shaping of the cooling fins in staggered heat sinks is numerically studied. It is shown that by rounding the cooling fins, the aerodynamic efficiency is increased without affecting the thermal efficiency. Three different geometries (in-line rectangular, staggered rectangular and rounded staggered shape) have been compared. These three different layouts were studied to obtain the best ratio between the removed heat and the energy spent to drive the coolant flow through the cooling fins. The main purpose of the paper is to determine the influence of the rounded shape on the average performance. As an example, it was found that a rounded staggered fin layout removes the same heat for an incident air velocity of 4 m/s as a classical in-line fin layout with a higher air speed of 6 m/s, with a reduction of fan power consumption by more than 60%. (C) 2004 Elsevier Ltd. All rights reserved.
引用
收藏
页码:1181 / 1187
页数:7
相关论文
共 11 条
[1]  
AZAR K, 2002, P INT WORKSH THERM I
[2]   A comparison of heat sink geometries for laminar forced convection: Numerical simulation of periodically developed flow [J].
Behnia, M ;
Copeland, D ;
Soodphakdee, D .
ITHERM '98: SIXTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, 1998, :310-315
[3]  
INCROPERA FP, 1985, INTRO HEAT TRANSFER, P243
[4]   Comparison between the standard and staggered layout for cooling fins in forced convection cooling [J].
Leon, O ;
De Mey, G ;
Dick, E ;
Vierendeels, J .
JOURNAL OF ELECTRONIC PACKAGING, 2003, 125 (03) :442-446
[5]   Study of the optimal layout of cooling fins in forced convection cooling [J].
Leon, O ;
De Mey, G ;
Dick, E .
MICROELECTRONICS RELIABILITY, 2002, 42 (07) :1101-1111
[6]  
Leon O., 2002, P 8 INT WORKSH THERM, P260
[7]  
LEON O, 2003, THESIS U GHENT
[8]   Numerical and experimental evaluation of planar and staggered heat sinks [J].
Sathyamurthy, P ;
Runstadler, PW .
INTERSOCIETY CONFERENCE ON THERMAL PHENOMENA IN ELECTRONIC SYSTEMS - I-THERM V, 1996, :132-139
[9]   Comparison of the cooling performance of staggered and in-line arrays of electronic packages [J].
Wirtz, RA ;
Colban, DM .
JOURNAL OF ELECTRONIC PACKAGING, 1996, 118 (01) :27-30
[10]  
Yang J, 2002, J UNIV SCI TECHNOL B, V9, P25