Design of directional couplers using multilayer thick-film technology

被引：1

作者：

Tian, ZG ^{[1
]}

Free, C ^{[1
]}

Aitchison, C ^{[1
]}

Barnwell, P ^{[1
]}

Wood, J ^{[1
]}

机构：

[1] Middlesex Univ, London N11 2NQ, England

来源：

RAWCON 2002: IEEE RADIO AND WIRELESS CONFERENCE, PROCEEDINGS | 2002年

关键词：

D O I：

10.1109/RAWCON.2002.1030167

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

The performance of multilayer directional couplers using a range of different thick-film dielectrics has been investigated The properties of multilayer coupled lines are examined using their coupled-mode parameters. It is found that the optimum performance of multilayer directional couplers is large v affected by the thick-film dielectric used. A practical design strategy for multilayer directional couplers is developed, which overcomes the problem of excessive computation that is normally associated with the optimization of multilayer circuit designs. The methodology has been verified through the design and measurement of wide bandwidth 2dB and 3dB directional couplers that were fabricated using multilayer, thick-film technology.

引用

页码：261 / 264

页数：4