Analysis of Wave Propagation along Coaxial Through Silicon Vias Using a Matrix Method

被引:0
|
作者
Dahl, David [1 ,3 ]
Beyreuther, Anne [2 ]
Duan, Xiaomin [2 ]
Ndip, Ivan [2 ,3 ]
Lang, Klaus-Dieter [2 ,3 ]
Schuster, Christian [1 ]
机构
[1] TUHH, Inst Theoret Elektrotech, D-21079 Hamburg, Germany
[2] Fraunhofer Inst Reliabil & Microintegrat IZM, Berlin, Germany
[3] Tech Univ Berlin, Sch Elect Engn & Comp Sci, Berlin, Germany
关键词
through silicon vias; 3D interconnects; multilayer coaxial waveguides; matrix method;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper presents an efficient method for the determination of the dispersion relation of wave propagation along coaxial structures with radially layered dielectric filling based on a matrix method known from the theory of optical waveguides. The method is applied for investigations of coaxial through silicon vias having different dimensions and different conductivities of the silicon semiconductor filling. The fundamental modes are derived, results are correlated to full-wave simulation results, and the physical phenomena of quasi TEM, slow-wave and skin-effect propagation in the fundamental mode are discussed with regard to signal integrity.
引用
收藏
页数:4
相关论文
共 50 条
  • [21] Analysis of wave propagation through functionally graded porous cylindrical structures considering the transfer matrix method
    Shahsavari, Hesamoddin
    Talebitooti, Roohollah
    Kornokar, Mohammad
    THIN-WALLED STRUCTURES, 2021, 159 (159)
  • [22] Analysis of Crosstalk Delay using Mixed CNT Bundle based Through Silicon Vias
    Majumder, Manoj Kumar
    Kumari, Archana
    Kaushik, B. K.
    Manhas, S. K.
    2014 IEEE RADIO FREQUENCY INTEGRATED CIRCUITS SYMPOSIUM, 2014, : 441 - 444
  • [23] Printing Method for Redistribution Layer and Filling of Through Silicon Vias Using Sintering Silver Paste
    Lee, Chia-Yen
    Tsai, Hsin-Chang
    2014 9TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT), 2014, : 466 - 469
  • [24] Preconditioned Adaptive Integral Method for Fast Electromagnetic Analysis of Arrays of Through-Silicon Vias
    Rong, Aosheng
    Cangellaris, Andreas C.
    Ling, Feng
    2014 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM (IMS), 2014,
  • [25] Electrical Modeling and Characterization of Silicon-Core Coaxial Through-Silicon Vias in 3-D Integration
    Qian, Libo
    Xia, Yinshui
    He, Xitao
    Qian, Kefang
    Wang, Jian
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 8 (08): : 1336 - 1343
  • [26] FIB/SEM Structural Analysis Of Through-Silicon-Vias
    Bender, H.
    Drijbooms, C.
    Radisic, A.
    FRONTIERS OF CHARACTERIZATION AND METROLOGY FOR NANOELECTRONICS: 2011, 2011, 1395
  • [27] Analysis of Multiple Vias Coupling in Silicon Interposer by using Cylindrical Mode Expansion Method
    Li, Jun
    Wei, Xing-Chang
    Li, Er-Ping
    2014 XXXITH URSI GENERAL ASSEMBLY AND SCIENTIFIC SYMPOSIUM (URSI GASS), 2014,
  • [28] Material Characterization and Failure Analysis of Through-Silicon Vias
    Wu, Chenglin
    Jiang, Tengfei
    Im, Jay
    Liechti, Kenneth M.
    Huang, Rui
    Ho, Paul S.
    2014 IEEE 21ST INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA), 2014, : 312 - 316
  • [29] Scalable Modeling of Through Silicon Vias Up to Milimeter-Wave Frequency
    Lu, Kuan-Chung
    Horng, Tzyy-Sheng
    Chen, Chi-Han
    Hung, Chang-Ying
    Lee, Pao-Nan
    Wang, Meng-Jen
    Hung, Chih-Pin
    Tong, Ho-Ming
    2012 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM (EDAPS), 2012, : 168 - 171
  • [30] Theoretical study of wave propagation along the coaxial waveguide filled with moving magnetized plasma
    张雅鑫
    贾佳
    刘盛纲
    鄢扬
    Chinese Physics B, 2010, (10) : 343 - 351