Analysis of Wave Propagation along Coaxial Through Silicon Vias Using a Matrix Method

被引：0

作者：

Dahl, David ^{[1
,3
]}

Beyreuther, Anne ^{[2
]}

Duan, Xiaomin ^{[2
]}

Ndip, Ivan ^{[2
,3
]}

Lang, Klaus-Dieter ^{[2
,3
]}

Schuster, Christian ^{[1
]}

机构：

[1] TUHH, Inst Theoret Elektrotech, D-21079 Hamburg, Germany

[2] Fraunhofer Inst Reliabil & Microintegrat IZM, Berlin, Germany

[3] Tech Univ Berlin, Sch Elect Engn & Comp Sci, Berlin, Germany

来源：

2014 IEEE 18TH WORKSHOP ON SIGNAL AND POWER INTEGRITY (SPI) | 2014年

关键词：

through silicon vias; 3D interconnects; multilayer coaxial waveguides; matrix method;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents an efficient method for the determination of the dispersion relation of wave propagation along coaxial structures with radially layered dielectric filling based on a matrix method known from the theory of optical waveguides. The method is applied for investigations of coaxial through silicon vias having different dimensions and different conductivities of the silicon semiconductor filling. The fundamental modes are derived, results are correlated to full-wave simulation results, and the physical phenomena of quasi TEM, slow-wave and skin-effect propagation in the fundamental mode are discussed with regard to signal integrity.

引用

页数：4

共 50 条

[1] Electrical Characterization of Coaxial Silicon-Insulator-Silicon Through-Silicon Vias: Theoretical Analysis and Experiments
Chen, Zhiming
Xiong, Miao
Li, Bohao
Li, An'an
Yan, Yangyang
Ding, Yingtao
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2016, 63 (12) : 4880 - 4887
[2] Analytical model for the propagation delay of through silicon vias
Khalil, DiaaEldin
Ismail, Yehea
Khellah, Muhammad
Karnik, Tanay
De, Vivek
ISQED 2008: PROCEEDINGS OF THE NINTH INTERNATIONAL SYMPOSIUM ON QUALITY ELECTRONIC DESIGN, 2008, : 553 - +
[3] Coaxial Through-Silicon-Vias Using Low-κ SiO2 Insulator
Yu, Pengbo
Lin, Hongxiao
He, Zhiwei
Song, Changming
Cai, Jian
Wang, Qian
Wang, Zheyao
2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020), 2020, : 1167 - 1172
[4] Efficient Analysis of Wave Propagation for Through-Silicon-Via Pairs using Multipole Expansion Method
Duan, Xiaomin
Dahl, David
Schuster, Christian
Ndip, Ivan
Lang, Klaus-Dieter
2015 IEEE 19TH WORKSHOP ON SIGNAL AND POWER INTEGRITY (SPI), 2015,
[5] Electrical Modeling and Analysis of Cu-CNT Heterogeneous Coaxial Through-Silicon Vias
Lu, Qijun
Zhu, Zhangming
Yang, Yintang
Ding, Ruixue
Li, Yuejin
IEEE TRANSACTIONS ON NANOTECHNOLOGY, 2017, 16 (04) : 695 - 702
[6] INTERFACIAL DELAMINATION BETWEEN THROUGH SILICON VIAS (TSVS) AND SILICON MATRIX
Lu, Kuan Hsun
Ryu, Suk-Kyu
Zhao, Qiu
Huang, Rui
Ho, Paul S.
PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION 2010, VOL 4, 2012, : 117 - 124
[7] Wave propagation analysis using the variance matrix
Sharma, Richa
Ivan, J. Solomon
Narayanamurthy, C. S.
JOURNAL OF THE OPTICAL SOCIETY OF AMERICA A-OPTICS IMAGE SCIENCE AND VISION, 2014, 31 (10) : 2185 - 2191
[8] Experimental characterization of coaxial through silicon vias for 3D integration
Adamshick, Stephen
Coolbaugh, Douglas
Liehr, Michael
MICROELECTRONICS JOURNAL, 2015, 46 (05) : 377 - 382
[9] Wideband Electromagnetic Modeling of Coaxial-Annular Through-Silicon Vias
Lu, Qijun
Zhu, Zhangming
Liu, Yang
Liu, Xiaoxian
Yin, Xiangkun
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2018, 60 (06) : 1915 - 1922
[10] Application of through Silicon vias on Millimeter-Wave Silicon Based Antenna
Zhou Dali
Yang Jiapeng
Zhou Jun
Shen Ya
2017 2ND IEEE INTERNATIONAL CONFERENCE ON INTEGRATED CIRCUITS AND MICROSYSTEMS (ICICM), 2017, : 321 - 325

← 1 2 3 4 5 →