Study of fluxless soldering using formic acid vapor

被引：64

作者：

Lin, W ^{[1
]}

Lee, YC ^{[1
]}

机构：

[1] Univ Colorado, Dept Mech Engn, Boulder, CO 80309 USA

来源：

IEEE TRANSACTIONS ON ADVANCED PACKAGING | 1999年 / 22卷 / 04期

关键词：

electronic packaging; fluxless; formic cid; self alignment; solder reflow;

D O I：

10.1109/6040.803451

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This paper presents a systematic study of the use of formic acid vapor fluxless soldering with eutectic Pb/Sn solder. The study focused on the solder joint self-aligning process and the final alignment accuracy. The main effect considered was the formic acid vapor concentration. In addition, other effects of solder joint height and background vibration were studied. The self-alignment characteristics of the fluxless soldering process was as good as those using liquid flux at 220 degrees C, 2 mu m alignment: accuracy could be achieved within 10 s. The most important parameter was the formic acid vapor concentration in the reflow chamber. The effective concentration window was found to be greater than 0.7% in volume.

引用

页码：592 / 601

页数：10