A series solution approach to an analytical load-deflection relation for the measurement of mechanical properties of thin films

被引:19
作者
Loy, CT [1 ]
Pradhan, SC [1 ]
Ng, TY [1 ]
Lam, KY [1 ]
机构
[1] Inst High Performance Comp, Singapore 118261, Singapore
关键词
D O I
10.1088/0960-1317/9/4/309
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The load-deflection technique is a popular technique to measure mechanical properties such as internal stress and Young's modulus of thin films. The measurement of internal stress and Young's modulus depends on the determination of the analytical load-deflection relation. In this paper, a series solution approach is presented to obtain the analytical load-deflection relation for a circular membrane. To determine the number of terms required for the results to settle to a stable value, a convergence study is carried out. The present study found that to obtain the analytical load-deflection relation using a series solution approach, the transverse displacement can only admit one term solution, while the in-plane displacement can have a series solution. The present approach has been verified with a finite-element solution obtained using Macneal-Schwendler Corporation Nastran by comparing maximum deflections as well as deflection curves. The agreement is excellent.
引用
收藏
页码:341 / 344
页数:4
相关论文
共 4 条
[1]   A TECHNIQUE FOR THE DETERMINATION OF STRESS IN THIN-FILMS [J].
BROMLEY, EI ;
RANDALL, JN ;
FLANDERS, DC ;
MOUNTAIN, RW .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1983, 1 (04) :1364-1366
[2]   NOVEL MICROSTRUCTURES FOR THE INSITU MEASUREMENT OF MECHANICAL-PROPERTIES OF THIN-FILMS [J].
MEHREGANY, M ;
HOWE, RT ;
SENTURIA, SD .
JOURNAL OF APPLIED PHYSICS, 1987, 62 (09) :3579-3584
[3]  
SCHNEIDER DM, 1995, J MICROELECTROMECH S, V4, P238
[4]   MECHANICAL PROPERTY MEASUREMENTS OF THIN-FILMS USING LOAD DEFLECTION OF COMPOSITE RECTANGULAR MEMBRANES [J].
TABATA, O ;
KAWAHATA, K ;
SUGIYAMA, S ;
IGARASHI, I .
SENSORS AND ACTUATORS, 1989, 20 (1-2) :135-141