The influence of size and composition on the creep of SnAgCu solder joints

被引：0

作者：

Wiese, S. ^{[1
]}

Roellig, M. ^{[1
]}

Mueller, M. ^{[1
]}

Rzepka, S. ^{[2
,3
]}

Nocke, K. ^{[2
,3
]}

Luhmann, C. ^{[2
,3
]}

Kraemer, F. ^{[1
]}

Meier, K. ^{[1
]}

Wolter, K. -J. ^{[1
]}

机构：

[1] Tech Univ Dresden, Elect Packaging Lab, D-8027 Dresden, Germany

[2] Qimonda Dresden GmbH & Co OHG, Dresden, Germany

[3] Tech Univ Dresden, IAVT, D-01062 Dresden, Germany

来源：

ESTC 2006: 1ST ELECTRONICS SYSTEMINTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS | 2006年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The paper presents creep data, that was gained on non eutectic SnAgCu-solder specimens with a variety of compositions. The non eutectic SnAgCu-Alloys were tested in different specimen sizes: bulk specimens, FBGA solder balls, flip chip solder joints. The results of the creep experiments show that both, solder alloy composition and solder joint size have a significant influence of the creep properties of the solder material. Bulk solder specimens have a rectangular cross section of 4mm X 3mm and contained the following alloys: Sn98Ag2, Sn97Ag3, Sn96Ag4, Sn97.5Ag2Cu0.5, Sn97.1Ag2Cu0.9, Sn98.8Ag2Cu1.2, Sn965Ag3Cu0.5, Sn96.1Ag3Cu0.9, Sn95.8Ag3Cu1.2, Sn96.9Ag3Au0.1. FBGA solder balls contained three non eutectic alloys with a content of 0,5% < Ag < 4% and 0,2% < Cu < 0,8%. Flip chip solder joints contained an eutectic Sn96.5Ag3.5 alloy and an non-eutectic SnAg alloy with Ag < 3%. Creep experiments have been carried out in a temperature range between T = 5 degrees C... 150 degrees C. The microstructures of the various solder specimens have been analysed to understand their differences in creep behavior.

引用

页码：912 / +

页数：3