PTLPB of Si3N4 to FA-129 using nickel as a core interlayer

被引：19

作者：

Brochu, M

Pugh, MD

Drew, RAL

机构：

[1] McGill Univ, Dept Min Met & Mat Engn, Montreal, PQ H3A 2B2, Canada

[2] Concordia Univ, Montreal, PQ H3G 1M8, Canada

来源：

INTERNATIONAL JOURNAL OF REFRACTORY METALS & HARD MATERIALS | 2004年 / 22卷 / 2-3期

关键词：

silicon nitride; iron aluminide; PTLPB; interlayer; joining ceramic; reaction layer;

D O I：

10.1016/j.ijrmhm.2004.01.003

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Partial transient liquid phase bonding was applied to a silicon nitride/iron aluminide alloy (FA-129) joint. This joint was composed of two independent joining systems. The joint configuration was Si3N4/75Cu-25Ti/Cu/Ni/Al/FA-129. The results demonstrate that homogenization has no effect on the kinetic of the reaction layer formation between the ceramic and the nickel core due to a previous dissolution reaction. The reaction layer composition evolves from a TiN-Ti5Si3 layer system after reaction during the first soaking time, to a single TiN layer after the complete cycle. The dissolution of the Ti5Si3 layer in the Ni core becomes the driving factor influencing the properties of the joint. The composition of the copper-nickel alloy interlayer changes with homogenization treatment, passing from a maximum of 70-20 wt% Cu, depending on the conditions. NiAl and Ni3Al intermetallics were observed at the interface between the nickel and the FA-129 and their thicknesses varies with the homogenization conditions. The strength values obtained were within the range of 80 MPa, with the ceramic reaction layer being the region where all failures occurred. (C) 2004 Elsevier Ltd. All rights reserved.

引用

页码：95 / 103

页数：9

共 19 条

[1]

[Anonymous], 1998, JOINING PROCESSES IN

[2]

*ASM INT, 1994, ASM HDB, V3, P2

[3]

*ASM INT, 1994, ASM HDB, V3, P3

[4]

BROCHU M, 2002, 26 ANN INT C ADV CER, V23, P801

[5]

BROCHU M, UNPUB

[6] An evaluation of the partial, transient liquid phase bonding of Si3N4 using Au coated Ni-22Cr foils [J].

Ceccone, G ;

Nicholas, MG ;

Peteves, SD ;

Tomsia, AP ;

Dalgleish, BJ ;

Glaeser, AM .

ACTA MATERIALIA, 1996, 44 (02) :657-667

[7] Bonding of silicon nitride ceramics using Fe-Ni/Cu/Ni/Cu/Fe-Ni interlayers [J].

Fang, F ;

Zheng, C ;

Lou, HQ ;

Sui, RZ .

MATERIALS LETTERS, 2001, 47 (03) :178-181

[8]

Fernie J.A., 1992, MET MATER, P212

[9] New approaches to joining ceramics for high-temperature applications [J].

Locatelli, MR ;

Dalgleish, BJ ;

Nakashima, K ;

Tomsia, AP ;

Glaeser, AM .

CERAMICS INTERNATIONAL, 1997, 23 (04) :313-322

[10] Diffusion in intermetallic phases of the Fe-Al and Fe-Si systems [J].

Mehrer, H ;

Eggersmann, M ;

Gude, A ;

Salamon, M ;

Sepiol, B .

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 1997, 240 :889-898

← 1 2 →