Pronounced effects of Zn additions on Cu-Sn microjoints for chip-stacking applications

被引：17
作者：
Wang, Y. W. [1 ]
Yang, T. L. [1 ]
Wu, J. Y. [1 ]
Kao, C. R. [1 ]
机构：
[1] Natl Taiwan Univ, Dept Mat Sci & Engn, Taipei, Taiwan
来源：
JOURNAL OF ALLOYS AND COMPOUNDS | 2018年 / 750卷
关键词：
3D IC integration; Microjoints; Interfacial reactions; Zn; SOLDERING REACTIONS; JOINTS; NI;
D O I：
10.1016/j.jallcom.2018.04.028
中图分类号：
O64 [物理化学（理论化学）、化学物理学];
学科分类号：
070304 ; 081704 ;
摘要：
The strong effects of Zn addition on the reaction between Sn-based solders and Cu substrate are widely known. Nevertheless, all of the previous studies are limited to the situation in which the solder volume was relatively large, and the effects of Zn on the much smaller microjoints remain unclear. In this work, the effect of Zn addition on the reaction in microjoints is investigated. Sandwich structures of Cu/Sn/Cu and Cu/SnxZn/Cu (x = 0.4, 0.7, and 1 wt%) are prepared by thermal compression bonding. The thickness of Sn or SnxZn layer is controlled at 10 mu m. It is found that Zn addition significantly retards the growth of Cu3Sn, and the growth of Cu6Sn5 is also slowed down. The results of this study suggest that it is possible to avoid the total conversion of Sn into brittle intermetallics during the lifetime of microjoints by the addition of a proper amount of Zn. (C) 2018 Elsevier B.V. All rights reserved.
引用
收藏
页码：570 / 576
页数：7
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  • [1] Wafer-Level Package With Simultaneous TSV Connection and Cavity Hermetic Sealing by Solder Bonding for MEMS Device
    Cao, Yuhan
    Ning, Wenguo
    Luo, Le
    [J]. IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2009, 32 (03): : 125 - 132
  • [2] Phase equilibria of the Sn-Zn-Cu ternary system
    Chou, Chin-Yi
    Chen, Sinn-Wen
    [J]. ACTA MATERIALIA, 2006, 54 (09) : 2393 - 2400
  • [3] Intermetallics characterization of lead-free solder joints under isothermal aging
    Choubey, Anupam
    Yu, Hao
    Osterman, Michael
    Pecht, Michael
    Yun, Fu
    Li Yonghong
    Ming, Xu
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 2008, 37 (08) : 1130 - 1138
  • [4] Critical Concerns in Soldering Reactions Arising from Space Confinement in 3-D IC Packages
    Chuang, H. Y.
    Yang, T. L.
    Kuo, M. S.
    Chen, Y. J.
    Yu, J. J.
    Li, C. C.
    Kao, C. Robert
    [J]. IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2012, 12 (02) : 233 - 240
  • [5] Elimination of voids in reactions between Ni and Sn: A novel effect of silver
    Chuang, H. Y.
    Yu, J. J.
    Kuo, M. S.
    Tong, H. M.
    Kao, C. R.
    [J]. SCRIPTA MATERIALIA, 2012, 66 (3-4) : 171 - 174
  • [6] Effects of limited Cu supply on soldering reactions between SnAgCu and Ni
    Ho, C. E.
    Lin, Y. W.
    Yang, S. C.
    Kao, C. R.
    Jiang, D. S.
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 2006, 35 (05) : 1017 - 1024
  • [7] Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying addition
    Kang, SK
    Leonard, D
    Shih, DY
    Gignac, L
    Henderson, DW
    Cho, S
    Yu, J
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 2006, 35 (03) : 479 - 485
  • [8] Controlling Ag3Sn plate formation, in near-ternary-eutectic Sn-Ag-Cu solder by minor Zn alloying
    Kang, SK
    Shih, DY
    Leonard, D
    Henderson, DW
    Gosselin, T
    Cho, SI
    Yu, J
    Choi, WK
    [J]. JOM, 2004, 56 (06) : 34 - 38
  • [9] A Study on the Bonding Process of Cu Bump/Sn/Cu Bump Bonding Structure for 3D Packaging Applications
    Lee, Byunghoon
    Park, Jongseo
    Jeon, Seong-jae
    Kwon, Kee-won
    Lee, Hoo-jeong
    [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2010, 157 (04) : H420 - H424
  • [10] Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process
    Li, J. F.
    Agyakwa, P. A.
    Johnson, C. M.
    [J]. ACTA MATERIALIA, 2011, 59 (03) : 1198 - 1211
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