Wafer-level package interconnect options

被引:12
作者
Balachandran, Jayaprakash [1 ]
Brebels, Steven
Carchon, Geert
Kuijk, Maarten
De Raedt, Walter
Nauwelaers, Bart K. J. C.
Beyne, Eric
机构
[1] IMEC VZW, B-3001 Heverlee, Leuven, Belgium
[2] Free Univ Brussels, Dept Elect & Informat ETRO, B-1050 Brussels, Belgium
[3] Catholic Univ Louvain, B-3001 Heverlee, Leuven, Belgium
关键词
global interconnects; package; performance metrics; transmission lines;
D O I
10.1109/TVLSI.2006.878229
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
As integrated circuit technology enters the nanometer era, global interconnects are becoming a bottleneck for overall chip performance. In this paper, we show that wafer-level package interconnects are an effective alternative to conventional on-chip global wires. These interconnects behave as LC transmission lines and can be exploited for their near speed of tight transmission and low attenuation characteristics. We compare performance measures such as bandwidth, bandwidth density, latency, and power consumption of the package-level transmission lines with conventional on-chip global interconnects for different International Technology Roadmap for Semiconductors (ITRS) technology nodes. Based on these results, we show that package-level interconnects are well suited for power demanding low-latency applications. We also analyze different interconnect options such as memory buses, long inter tile interconnects, clock, and power distribution.
引用
收藏
页码:654 / 659
页数:6
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