Bonding at compatible and incompatible amorphous interfaces of polystyrene and poly(methyl methacrylate) below the glass transition temperature

被引:21
作者
Boiko, YM
Lyngaae-Jorgensen, J
机构
[1] Tech Univ Denmark, Danish Polymer Ctr, DK-2800 Lyngby, Denmark
[2] AF Ioffe Phys Tech Inst, Dept Fracture Phys, St Petersburg, Russia
来源
JOURNAL OF MACROMOLECULAR SCIENCE-PHYSICS | 2004年 / B43卷 / 03期
关键词
poly(methyl methacrylate); polystyrene; polymer interfaces; lap-shear; glass transition temperature;
D O I
10.1081/MB-120030015
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
Films of high-molecular-weight amorphous polystyrene (PS, M-w = 225 kg/mol, M-w/M-n = 3, T-g-bulk = 97degreesC, where T-g-bulk is the glass transition temperature of the bulk sample) and poly(methyl methacrylate) (PMMA, M-w = 87 kg/mol, M-w/M-n = 2, Tg-bulk = 109degreesC) were brought into contact in a lap-shear joint geometry at a constant healing temperature T-h, between 44degreesC and 114degreesC, for 1 or 24 hr and submitted to tensile loading on an Instron tester at ambient temperature. The development of the lap-shear strength sigma at an incompatible PS-PMMA inter-face has been followed in regard to those at compatible PS-PS and PMMA-PMMA interfaces. The values of strength for the incompatible PS-PMMA and compatible PMMA-PMMA interfaces were found to be close, both being smaller by a factor of 2 to 3 than the values of or for the PS-PS interface developed after healing at the same conditions. This observation suggests that the development of the interfacial structure at the PS-PMMA interface is controlled by the slow component, i.e., PMMA. Bonding at the three interfaces investigated was mechanically detected after healing for 24 hr at T-h = 44degreesC, i.e., well below Tg-bulkS of PS and PMMA, with the observation of very close values of the lap-shear strength for the three interfaces considered, 0.11-0.13 MPa. This result indicates that the incompatibility between the chain segments of PS and PMMA plays a negligible negative role in the interfacial bonding well below Tg-bulk.
引用
收藏
页码:695 / 709
页数:15
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