3D Packaging Technology for Integrated Antenna Front-Ends

被引：0

作者：

Bonnet, Barbara ^{[1
]}

Monfraix, Philippe ^{[1
]}

Chiniard, Renaud ^{[2
]}

Chaplain, Jerome ^{[3
]}

Drevon, Claude ^{[1
]}

Legay, Herve ^{[1
]}

Couderc, Pascal ^{[3
]}

Cazaux, Jean-Louis ^{[1
]}

机构：

[1] Thales Alenia Space, 26 Av JF Champollion,BP1187, F-31037 Toulouse 1, France

[2] Thales Serv, F-31400 Toulouse, France

[3] 3D Plus, F-78532 BUC, France

来源：

2008 EUROPEAN MICROWAVE CONFERENCE, VOLS 1-3 | 2008年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Thanks to Vertical Multi-Chip Module packaging technology (MCM-V), a novel concept of integrated antenna feed in Ka band has been developed. This technology enables the integration of active elements very close to the radiating surface, which reduces dramatically the weight and volume of the antenna. In this paper the different technological building blocks are described, and the measurements obtained on the first breadboard are discussed. The promising results obtained should. lead to a major breakthrough for active receive antennas, driving down cost and complexity.

引用

页码：720 / +

页数：2

共 9 条

[1]

DREVON C, 1999, WIRELESS WORKSHOP P, P6

[2] Dielectric resonator antenna with orthogonal slotline feed [J].

Lathière, G ;

Gillard, R ;

Legay, H .

ELECTRONICS LETTERS, 2004, 40 (12) :715-716

[3]

LEGAY H, 2005, Patent No. 1605546

[4]

Monfraix P., 1998, 1998 IEEE MTT-S International Microwave Symposium Digest (Cat. No.98CH36192), P1289, DOI 10.1109/MWSYM.1998.700610

[5]

MONFRAIX P, 1997, P IMS C DENV JUN

[6]

ULIAN P, 1998, P 28 EUMC 98, V1, P271

[7]

VAL C, 1990, IEEE TRANSITION COMP, V12

[8]

Vendier O, 2002, ESA SP PUBL, V507, P221

[9]

VENDIER O, 1999, P 29 EUMC 99, V3, P379

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