Recent progress in the development of a B-factory monolithic active pixel detector

被引:0
|
作者
Stanic, S.
Aihara, H.
Barbero, M.
Bozek, A.
Browder, T.
Hazumi, M.
Kennedy, J.
Kent, N.
Olsen, S.
Palka, H.
Rosen, M.
Ruckman, L.
Trabelsi, K.
Tsuboyama, T.
Uchida, K.
Varner, G.
Yang, Q.
机构
[1] Univ Nova Gorica, Nova Gorica, Slovenia
[2] Univ Tokyo, Dept Phys, Bunkyo Ku, Tokyo 1130033, Japan
[3] Univ Hawaii, Dept Phys & Astron, Honolulu, HI 96822 USA
[4] Polish Acad Sci, H Niewodniczanski Inst Nucl Phys, PL-31342 Krakow, Poland
[5] KEK, High Energy Accelerator Res Org, Tsukuba, Ibaraki 3050801, Japan
关键词
B-factory; vertex detector; monolithic active pixel sensor; CMOS; radiation hard;
D O I
10.1016/j.nima.2006.05.274
中图分类号
TH7 [仪器、仪表];
学科分类号
0804 ; 080401 ; 081102 ;
摘要
Due to the need for precise vertexing at future higher luminosity B-factories with the expectedly increasing track densities and radiation exposures, upgrade of present silicon strip detectors with thin, radiation resistant pixel detectors is highly desired. Considerable progress in the technological development of thin CMOS based Monolithic Active Pixel Sensors (MAPS) in the last years makes them a realistic upgrade option and the feasibility studies of their application in Belle are actively pursued. The most serious concerns are their radiation hardness and their read-out speed. To address them, several prototypes denoted as Continuous Acquisition Pixel (CAP) sensors have been developed and tested. The latest of the CAP sensor prototypes is CAP3, designed in the TSMC 0.25 mu m process with a 5-deep sample pair pipeline in each pixel. A setup with several CAP3 sensors will be used to assess the performance of a full scale pixel read-out system running at realistic read-out speed. The results and plans for the next stages of R&D towards a full Pixel Vertex Detector (PVD) are presented. (c) 2006 Elsevier B.V. All rights reserved.
引用
收藏
页码:181 / 184
页数:4
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