Grain size distribution and heat conductivity of copper processed by equal channel angular pressing

被引：26

作者：

Gendelman, O. V. ^{[1
]}

Shapiro, M.

Estrin, Y.

Hellmig, R. J.

Lekhtmakher, S.

机构：

[1] Technion Israel Inst Technol, Fac Mech Engn, IL-32000 Haifa, Israel

[2] Tech Univ Clausthal, Inst Mat Sci & Engn, D-38678 Clausthal Zellerfeld, Germany

来源：

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2006年 / 434卷 / 1-2期

关键词：

equal channel angular pressing (ECAP); copper; thermal conductivity; grain size distribution; modelling;

D O I：

10.1016/j.msea.2006.06.091

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

We report the results of measurements of the grain size distribution function and the thermal conductivity of ultratine-grained copper produced by equal channel angular pressing (ECAP), with special attention to the evolution of these quantities with the number of pressing cycles. To explain the experimental findings, the equilibrium grain size distribution function (GSDF) evolving during ECAP has been calculated on the basis of a simplified theoretical model. The model involves a single unknown physical parameter-the most probable grain size. With this parameter fitted to the experimental data the calculated GSDF fairly closely reproduces the experimental data. A model for thermal conductivity of ECAP processed copper has been proposed, which relates thermal conductivity to the GSDF parameters and the coefficient of electron reflection at grain boundaries. (c) 2006 Elsevier B.V. All rights reserved.

引用

页码：88 / 94

页数：7

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