Comparison of the growth characteristics of SiC on Si between low-pressure CVD and triode plasma CVD

被引:5
作者
Yasui, K [1 ]
Hashiba, M [1 ]
Narita, Y [1 ]
Akahane, T [1 ]
机构
[1] Nagaoka Univ Technol, Dept Elect Engn, Nagaoka, Niigata 9402188, Japan
来源
SILICON CARBIDE AND RELATED MATERIALS 2001, PTS 1 AND 2, PROCEEDINGS | 2002年 / 389-3卷
关键词
3C-SiC; dimethysilane; low-pressure CVD; triode plasma CVD;
D O I
10.4028/www.scientific.net/MSF.389-393.367
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In order to investigate the effect of the supply of hydrogen radicals during the SiC growth, SiC films were grown on Si substrates by low-pressure thermal CVD (LPCVD) and triode plasma CVD using dimethylsilane (DMS). Activation energy for the epitaxial growth rate of SiC by LPCVD was estimated to be 73+/-5kcal/mol, whereas that by triode plasma CVD was about 48+/-2kcal/mol. As in the case of the growth rate of SiC using monomethylsilane (MMS), the activation energy by using the triode plasma CVD was reduced about 25kcal/mol in the case of DMS.
引用
收藏
页码:367 / 370
页数:4
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