Investigation of solar float glass hole cutting using 532 nm nanosecond pulsed laser

被引:4
作者
Li, Wenyuan [1 ,2 ]
Rong, Youmin [1 ,2 ]
Liu, Weinan [1 ,2 ]
Zhang, Guojun [1 ,2 ]
Wang, Hui [1 ,2 ]
Huang, Yu [1 ,2 ]
Gao, Zhangrui [3 ]
机构
[1] Huazhong Univ Sci & Technol, State Key Lab Digital Mfg Equipment & Technol, Wuhan, Peoples R China
[2] Huazhong Univ Sci & Technol, Sch Mech Sci & Engn, Wuhan, Peoples R China
[3] HG Farley Laserlab Cutting Welding Syst Engn Co L, Wuhan, Peoples R China
来源
OPTIK | 2020年 / 222卷
基金
中国国家自然科学基金;
关键词
Laser cutting; Solar Float glass; Surface quality; Cutting efficiency; SHEETS;
D O I
10.1016/j.ijleo.2020.165457
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
Solar float glass is widely used in photovoltaic field to make solar double glass module, because of its high visible light transmittance. 532 nm nanosecond laser was selected to cut solar float glass at a thickness of 2.5 mm, while cutting path was planned by a hybrid bottom-up multilayer increment and the spiral line method. Considering the influence of parameters (scanning speed, laser pulse repetition rate, spiral width and spiral overlap ratio) on surface quality and cutting efficiency, 37 groups of single-factor cutting experiments were designed and carried out. The results indicated that when the laser pulse repetition rate is 55 kHz, the corresponding laser power is 22.6 W (single pulse energy: 0.41 mJ), the scanning speed is 300 mm/s, and the spiral trajectory parameters are 0.45 mm and 70 % respectively, the chipping width has the minimum value of 104.81 um and a high cutting efficiency with a material removal rate of 4.712 mm(3)/s was achieved. The increase of four parameters can also improve cutting efficiency, but spiral overlap ratio has little effect. The laser processed surface defects, such as micro-cracks and voids are also less when the chipping width is small, and the content of surface elements is much closer to the glass substrate.
引用
收藏
页数:13
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共 29 条
[1]   Ionization behavior and dynamics of picosecond laser filamentation in sapphire [J].
Amina ;
Ji, Lingfei ;
Yan, Tianyang ;
Ma, Rui .
OPTO-ELECTRONIC ADVANCES, 2019, 2 (08) :1-7
[2]  
Arif M., 2011, Journal of Manufacturing Processes, V13, P50, DOI [10.1016/j.jmapro.2010.10.004, DOI 10.1016/J.JMAPRO.2010.10.004]
[3]   Influence of carbon material on the production process of different electric arc furnaces [J].
Chen, Zhengjie ;
Ma, Wenhui ;
Li, Shaoyuan ;
Wu, Jijun ;
Wei, Kuixian ;
Yu, Zhigiang ;
Ding, Weimin .
JOURNAL OF CLEANER PRODUCTION, 2018, 174 :17-25
[4]   Influence of carbothermic reduction on submerged arc furnace energy efficiency during silicon production [J].
Chen, Zhengjie ;
Ma, Wenhui ;
Wu, Jijun ;
Wei, Kuixian ;
Yang, Xi ;
Lv, Guoqiang ;
Xie, Keqiang ;
Yu, Jie .
ENERGY, 2016, 116 :687-693
[5]   Femtosecond filamentation in transparent media [J].
Couairon, A. ;
Mysyrowicz, A. .
PHYSICS REPORTS-REVIEW SECTION OF PHYSICS LETTERS, 2007, 441 (2-4) :47-189
[6]   Diffusion across the glass transition in silicate melts: Systematic correlations, new experimental data for Sr and Ba in calcium-aluminosilicate glasses and general mechanisms of ionic transport [J].
Fanara, Sara ;
Sengupta, Pranesh ;
Becker, Hans-Werner ;
Rogalla, Detlef ;
Chakraborty, Sumit .
JOURNAL OF NON-CRYSTALLINE SOLIDS, 2017, 455 :6-16
[7]   Latest achining Technologies of Hard-to-cut Materials by Ultrasonic Machine Tool [J].
Feucht, Florian ;
Ketelaer, Jens ;
Wolff, Alexander ;
Mori, Masahiko ;
Fujishima, Makoto .
6TH CIRP INTERNATIONAL CONFERENCE ON HIGH PERFORMANCE CUTTING (HPC2014), 2014, 14 :148-152
[8]   Femtosecond laser micromachining in transparent materials [J].
Gattass, Rafael R. ;
Mazur, Eric .
NATURE PHOTONICS, 2008, 2 (04) :219-225
[9]   Minimization of cutting force, temperature and surface roughness through GRA, TOPSIS and Taguchi techniques in end milling of Mg hybrid MMC [J].
Gopal, P. M. ;
Prakash, K. Soorya .
MEASUREMENT, 2018, 116 :178-192
[10]   Cutting glass substrates with dual-laser beams [J].
Jiao, Junke ;
Wang, Xinbing .
OPTICS AND LASERS IN ENGINEERING, 2009, 47 (7-8) :860-864