The development of a portable ultrahigh vacuum chamber via silicon block

被引:2
作者
Chuang, Ho-Chiao [1 ]
Huang, Chia-Shiuan [1 ]
机构
[1] Natl Taipei Univ Technol, Dept Mech Engn, Taipei 10608, Taiwan
关键词
Glass bonding - Ultrahigh vacuum - Vacuum applications - Glass;
D O I
10.1063/1.4879115
中图分类号
TH7 [仪器、仪表];
学科分类号
0804 ; 080401 ; 081102 ;
摘要
This paper describes a nonmetallic, light weight portable chamber for ultra-high vacuum (UHV) applications. The chamber consists of a processed silicon block anodically bonding five polished Pyrex glass windows and a Pyrex glass adapter, without using any screws, bolts or vacuum adhesives. The design features provide an alternative chamber for UHV applications which require nonmetallic components. We have cyclically baked the chamber up to 180 degrees C for 160 h and have achieved an ultimate pressure of 1.4 x 10(-9) Torr (limited by our pumping station), with no leak detected. Both Pyrex glass windows and Pyrex glass adapter have been used successfully. (C) 2014 AIP Publishing LLC.
引用
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页数:4
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