Analysis and understanding of unique cryogenic phenomena in state-of-the-art SiGeHBTs

被引:13
作者
Liang, Qingqing
Krithivasan, Ramkumar
Ahmed, Adrian
Lu, Yuan
Li, Ying
Cressler, John D.
Niu, Guofu
Rieh, Jae-Sung
Freeman, Greg
Ahlgren, Dave
Joseph, Alvin
机构
[1] IBM Microelect, Hopewell Jct, NY 12533 USA
[2] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30332 USA
[3] Auburn Univ, Dept Elect & Comp Engn, Auburn, AL 36830 USA
[4] IBM Microelect, Essex Jct, VT 05452 USA
[5] Korea Univ, Dept Elect & Comp Engn, Seoul 136701, South Korea
基金
美国国家航空航天局;
关键词
SiGeHBTs; silicon-germanium; heterejunction bipolar transistor; cryogenic; low temperature; negative differential resistance; hysteresis; tunneling; Shockley-Read-Hall recombination;
D O I
10.1016/j.sse.2006.04.027
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A group of novel device phenomena are reported in state-of-the-art SiGe HBTs operating at cryogenic temperatures. Both negative-differential-resistance (NDR) and an unusual "hysteresis" behavior are observed in the forced-I-B output characteristics of 350 GHz SiGe HBTs at cryogenic temperatures. Unlike the NDR effects in resonance-tunneling-diodes and III-V HBTs, the phenomena demonstrated in this paper are correlated to SiGe HBT high-injection effects and modulated by bias level. This unusual cryogenic behavior have been systematically investigated, and the results are compared to 50 GHz, 120 GHz, and 200 GHz SiGe HBT technology generations. An advanced Shockley-Read-Hall (SRH) recombination model including tunneling effects is introduced and used to explain the underlying NDR and "hysteresis" mechanisms in these cooled SiGe HBTs. Implications for potential novel device and circuit designs are suggested. (c) 2006 Elsevier Ltd. All rights reserved.
引用
收藏
页码:964 / 972
页数:9
相关论文
共 25 条
[1]  
[Anonymous], 2003, SILICON GERMANIUM HE
[2]   A novel 3-D integrated HFET/RTD frequency multiplier [J].
Auer, U ;
Prost, W ;
Janssen, G ;
Agethen, M ;
Reuter, R ;
Tegude, FJ .
IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS, 1996, 2 (03) :650-654
[3]  
Banerjee B, 2003, IEEE BIPOL BICMOS, P171
[4]   BIAS CIRCUIT EFFECTS ON THE CURRENT-VOLTAGE CHARACTERISTIC OF DOUBLE-BARRIER TUNNELING STRUCTURES - EXPERIMENTAL AND THEORETICAL RESULTS [J].
BELHADJ, CY ;
MARTIN, KP ;
BENAMOR, S ;
RASCOL, JJL ;
HIGGINS, RJ ;
POTTER, RC ;
HIER, H ;
HEMPFLING, E .
APPLIED PHYSICS LETTERS, 1990, 57 (01) :58-60
[5]   A thermal fully hydrodynamic model for semiconductor devices and applications to III-V HBT simulation [J].
Benvenuti, A ;
Coughran, WM ;
Pinto, MR .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1997, 44 (09) :1349-1359
[6]  
Cressler J. D., 2006, Silicon Heterostructure Handbook-Materials, Fabrication, Devices, Circuits, and Applications of SiGe and Si StrainedLayer Epitaxy
[7]   Standard CMOS implementation of a multiple-valued logic signed-digit adder based on negative differential-resistance devices [J].
González, AF ;
Bhattacharya, M ;
Kulkarni, S ;
Mazumder, P .
30TH IEEE INTERNATIONAL SYMPOSIUM ON MULTIPLE-VALUED LOGIC, PROCEEDINGS, 2000, :323-328
[8]  
Green Duncan, 2003, SILICON MONOLITHIC I, P22
[9]  
HURKX G, 1989, P EUROPEAN SOLID STA, P793
[10]   A NEW RECOMBINATION MODEL FOR DEVICE SIMULATION INCLUDING TUNNELING [J].
HURKX, GAM ;
KLAASSEN, DBM ;
KNUVERS, MPG .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1992, 39 (02) :331-338