The structure of TiN films deposited by arc ion plating

被引:18
作者
Matsue, T
Hanabusa, T
Ikeuchi, Y
机构
[1] Niihama Natl Coll Technol, Niihama 7928580, Japan
[2] Univ Tokushima, Fac Engn, Tokushima 7708506, Japan
关键词
arc ion plating; titanium nitride; crystal structure; X-ray diffraction; X-ray photoelectron spectroscopy;
D O I
10.1016/S0042-207X(02)00167-7
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The relationship between deposition conditions of TiN film deposited by arc ion plating and the resultant structure was investigated by X-ray diffraction. Bias voltage was varied systematically in order to clarify the effect of such a variation on the final structure of TiN films. At low bias voltage, the resultant TiN film exhibited strong {110} preferred orientation, whereas at high bias voltage, the dominant orientation of the film was {111}. The ratio of nitrogen, carbon, and oxygen to titanium at the film surface and the interface between the film and substrate was determined by X-ray photoelectron spectroscopy (XPS), revealing that the maximum N/Ti ratio is approximately 0.89 in TiN films that exhibit {110} and {111} preferred orientation on the film surface. Titanium oxides such as TiO2 or TiO were observed at the interface between the film and substrate in {110} oriented films, however these oxides were not observed in {111} orientated films. (C) 2002 Elsevier Science Ltd. All rights reserved.
引用
收藏
页码:435 / 439
页数:5
相关论文
共 10 条
[1]   RESIDUAL-STRESS IN ION-ASSISTED COATINGS [J].
BULL, SJ ;
JONES, AM ;
MCCABE, AR .
SURFACE & COATINGS TECHNOLOGY, 1992, 54 (1-3) :173-179
[2]  
CHANG TP, 1992, SURF COAT TECH, V54, P90
[3]   DEPOSITION OF TIN FILMS WITH TITANIUM INTERLAYER ON LOW-CARBON STEEL BY REACTIVE RF MAGNETRON SPUTTERING [J].
CHEN, YI ;
DUH, JG .
SURFACE & COATINGS TECHNOLOGY, 1991, 46 (03) :371-384
[4]   EXAMINATION OF RESIDUAL-STRESS, MORPHOLOGY AND MECHANICAL-PROPERTIES OF SPUTTERED TIN FILMS [J].
HOHL, F ;
STOCK, HR ;
MAYR, P .
SURFACE & COATINGS TECHNOLOGY, 1992, 54 (1-3) :160-166
[5]  
Konig W., 1992, Surface and Coatings Technology, V54-55, P453, DOI 10.1016/S0257-8972(07)80065-X
[6]  
Matsue T., 1999, Journal of the Society of Materials Science, Japan, V48, P699, DOI 10.2472/jsms.48.699
[7]   Residual stress in TiN film deposited by arc ion plating [J].
Matsue, T ;
Hanabusa, T ;
Miki, Y ;
Kusaka, K ;
Maitani, E .
THIN SOLID FILMS, 1999, 343 :257-260
[8]  
PETROV I, 1992, J VAC SCI TECHNOL A, V10, P5
[9]  
SLOOF WG, 1987, J MATER SCI, V22, P701
[10]   CHARACTERISTICS OF HOLLOW-CATHODE DISCHARGE PLASMA AND ITS APPLICATION FOR THE REACTIVE ION PLATING OF TIN AND TIC [J].
WHANG, KW ;
SEO, YW .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1993, 11 (04) :1496-1500