Integration of CMOS Front-end Circuits with Silicon Photonic Devices for High Speed PAM-4 Optical Links

被引：0

作者：

Hsu, Shawn S. H. ^{[1
]}

Li, Yan-Feng ^{[1
]}

Wang, Hao-Ju ^{[1
]}

Chen, Tai-Chun ^{[1
]}

Tseng, Chih-Kuo ^{[1
]}

Lee, Ming-Chang ^{[1
]}

Li, Ke ^{[2
]}

Thomson, David J. ^{[2
]}

Reed, Graham T. ^{[2
]}

机构：

[1] Natl Tsing Hua Univ, Dept Elect Engn, Hsinchu, Taiwan

[2] Univ Southampton, Optoelect Res Ctr, Southampton, Hants, England

来源：

2017 IEEE INTERNATIONAL SYMPOSIUM ON RADIO-FREQUENCY INTEGRATION TECHNOLOGY (RFIT) | 2017年

基金：

英国工程与自然科学研究理事会;

关键词：

Optical link; PAM-4; CMOS; transimpedance amplifier (TIA); modulator driver (MD); silicon photonics; TECHNOLOGY; AMPLIFIER;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents our recent studies on CMOS front-end circuits for high speed optical links. The circuit topologies of both transimpedance amplifier (TIA) and modulator driver (MD) are discussed for achieving wideband operation in PAM-4 modulation using advanced CMOS technology. Also, issues of integration of the circuits with silicon photonic devices such as the Ge-on-Si photo diode (PD) and silicon modulator are addressed for high performance silicon-based transceiver front-end of optical link.

引用

页码：250 / 252

页数：3

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