Coupling of large number of vias in electronic packaging structures and differential signaling

被引：5
作者：
Chen, HF [1 ]
Li, Q [1 ]
Tsang, L [1 ]
Jandhyala, V [1 ]
机构：
[1] Univ Washington, Dept Elect Engn, Seattle, WA 98195 USA
来源：
2002 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-3 | 2002年
关键词：
D O I：
10.1109/MWSYM.2002.1011794
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A method is presented for modeling multi-interaction among large number of vertical vias in densely packaged integrated circuits. The analysis of the interior problem is based upon the cylindrical wave expansion of the magnetic field Green's function and the foldy-lax multiple scattering formula. The exterior problem of bent traces is analyzed using MOM approach. A system matrix equation is obtained by combining the exterior and interior problem of which the solution gives the propagation characteristics of the entire structure. Using iterative solver, results are illustrated for problems of several thousand vias with moderate CPU and memory requirement. Also illustrated are the results for common and differential mode in differential signaling, including the effects of surrounding idle vias and shorting vias.
引用
收藏
页码：983 / 986
页数：4
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