Nanomechanical characterization of multilayered thin film structures for digital micromirror devices

被引:20
作者
Wei, GH
Bhushan, B
Jacobs, SJ
机构
[1] Ohio State Univ, Dept Mech Engn, Nanotribol Lab Informat Storage, Columbus, OH 43210 USA
[2] Ohio State Univ, Dept Mech Engn, MEMS, NEMS, Columbus, OH 43210 USA
[3] Texas Instruments Inc, DLPTM Prod Div, Dallas, TX 75243 USA
关键词
digital micromirror devices (DMD); nanoindentation; nanoscratch; residual stress; X-ray photoelectron spectroscopy (XPS); thin films;
D O I
10.1016/j.ultramic.2003.11.015
中图分类号
TH742 [显微镜];
学科分类号
摘要
The digital micromirror device (DMD), used for digital projection displays, comprises a surface-micromachined array of up to 2.07 million aluminum micromirrors (14 mum square and 15 mum pitch), which switch forward and backward thousands of times per second using electrostatic attraction. The nanomechanical properties of the thin-film structures used are important to the performance of the DMD. In this paper, the nanomechanical characterization of the single and multilayered thin film structures, which are of interest in DMDs, is carried out. The hardness, Young's modulus and scratch resistance of TiN/Si, SiO2/Si, Al alloy/Si, TiN/Al alloy/Si and SiO2/TiN/Al alloy/Si thin-film structures were measured using nanoindentation and nanoscratch techniques, respectively. The residual (internal) stresses developed during the thin film growth were estimated by measuring the radius of curvature of the sample before and after deposition. To better understand the nanomechanical properties of these thin film materials, the surface and interface analysis of the samples were conducted using X-ray photoelectron spectroscopy. The nanomechanical properties of these materials are analyzed and the impact of these properties on micromirror performance is discussed. (C) 2004 Elsevier B.V. All rights reserved.
引用
收藏
页码:375 / 389
页数:15
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