Effects of the oxygen fraction and substrate bias power on the electrical and optical properties of silicon oxide films by plasma enhanced chemical vapour deposition using TmOS/O2 gas

Thin oxide films are deposited from tetramethoxysilane in an inductively coupled oxygen glow discharge supplied with radio frequency power. The chemical bonding states of deposited films are analysed by Fourier transform infrared spectroscopy. The deposition rate and optical properties are determined from spectroscopic ellipsometry. Capacitance-voltage measurements are performed in MOS capacitors to obtain the electrical properties of the deposited films. With these tools, the effects of the substrate bias power and the oxygen mole fraction in the gas on the properties of the film are investigated. The refractive index first decreases with an increase in the oxygen mole fraction, and then increases again, showing a behaviour opposite to that of the deposition rate. The deposition rate increases with increasing substrate bias power and then saturates, while the refractive index increases slightly with an increase in the substrate bias power. The fixed oxide charge density decreases with increasing oxygen fraction and with increasing substrate bias power, while the interface trap density increases with increasing oxygen fraction and with increasing substrate bias power.