A numerical model for a hypoeutectic alloy droplet deposition with non-equilibrium solidification

被引:3
作者
Ramanuj, Vimal [1 ]
Tong, Albert Y. [1 ]
机构
[1] Univ Texas, Mech & Aerosp Engn Dept, Arlington, TX 76019 USA
关键词
TRANSPORT PHENOMENA; SURFACE; GRADIENT; SYSTEMS; HEAT;
D O I
10.1007/s10853-017-0842-y
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
A numerical model is developed to study the splat morphology and solidification characteristics of a molten hypoeutectic alloy droplet impinging and solidifying on a substrate. The study finds application in optimization and improvement of metal additive manufacturing processes such as solder jetting, microcasting, sputtering and 3D printing. The major mathematical and numerical challenges include solution of multiphase flow governing equations, interface tracking and modeling the non-equilibrium (rapid) solidification on a macroscopic domain. The free surface is tracked using a volume of fluid method with a piecewise linear interface construction while the mushy phase is modelled as a pseudo porous medium. An enthalpy formulation of the energy equation is coupled with the solute transport equation and the system is solved simultaneously for the temperature and concentration profiles until the eutectic point is reached; beyond which a special treatment is employed till complete solidification. Segregation models (with back diffusion) and eutectic phase diagram are incorporated in the solution procedure. The splat morphology, concentration profiles and microstructural properties are closely examined with emphasis on the convective effects and eutectic formation.
引用
收藏
页码:6034 / 6049
页数:16
相关论文
共 32 条
[21]  
Porter DA, 2009, Phase transformations in metals and alloys, V3rd, P209
[22]  
Ramanuj V, 2016, NUMERICAL MODELING A, P28
[23]   Metal-droplet deposition model including liquid deformation and substrate remelting [J].
Rangel, RH ;
Bian, X .
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 1997, 40 (11) :2549-2564
[24]  
Rudman M, 1997, INT J NUMER METH FL, V24, P671, DOI 10.1002/(SICI)1097-0363(19970415)24:7<671::AID-FLD508>3.0.CO
[25]  
2-9
[26]  
Spinelli José Eduardo, 2006, Mat. Res., V9, P51
[27]   Effect of solidification on solder bump formation in solder jet process: Simulation and experiment [J].
Tian De-wen ;
Wang Chun-qing ;
Tian Yan-hong .
TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA, 2008, 18 (05) :1201-1208
[28]   Numerical study on the solidification of liquid metal droplets impacting onto a substrate [J].
Tong, AY ;
Holt, BR .
NUMERICAL HEAT TRANSFER PART A-APPLICATIONS, 1997, 31 (08) :797-817
[29]  
Voller V.R., 2006, Handbook of Numerical Heat Transfer, V2, P593
[30]   AN ENTHALPY METHOD FOR CONVECTION DIFFUSION PHASE-CHANGE [J].
VOLLER, VR ;
CROSS, M ;
MARKATOS, NC .
INTERNATIONAL JOURNAL FOR NUMERICAL METHODS IN ENGINEERING, 1987, 24 (01) :271-284