On-Chip Transferrable Microdisk Lasers

被引:12
作者
Park, Sun-Wook [1 ]
Kim, Min-Woo [1 ]
Park, Kyong-Tae [1 ]
Ku, Ja-Hyun [1 ]
No, You-Shin [1 ]
机构
[1] Konkuk Univ, Dept Phys, Seoul 05029, South Korea
关键词
microdisk cavities; microlasers; transfer printing; hybrid integration; electromagnetic simulation; integrated photonic circuits; WAVE-GUIDE; SILICON; INTEGRATION;
D O I
10.1021/acsphotonics.0c01330
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Si photonics has been receiving substantial attention as an integration platform in photonics and optoelectronic research, owing to the ability to manufacture low-cost, compact integrated circuits. However, realizing efficient and high-quality light sources remains a major challenge. Herein, we report an on-chip transferrable low-threshold single microdisk laser, which is fabricated by the microtransfer printing using a structured polymer. The optically transparent and adhesive microtip enables readily reproducible, damage-free, and precisely aligned mm targeted transfer of a single microdisk in the growth substrate onto a prefabricated Si-post on a silicon-on-insulator wafer. Spectroscopic measurements revealed that the microdisk laser with a small Si-post exhibits rich lasing actions with an estimated threshold of similar to 96.8 mu W. A controlled experiment revealed that laser devices with varied Si-post sizes exhibit no significant changes in optical properties until the size of the Si-post becomes comparable with that of the microdisk. These observations agreed with the results of systematic three-dimensional numerical simulations. We believe that our microtransfer printing technique can be used to transfer micro- and nanostructures onto targeted locations and realize complex microscale heterogeneous architectures in a compact integrated circuit.
引用
收藏
页码:5313 / 5320
页数:8
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