COPPER PLATING FROM NON-CYANIDE ALKALINE BATHS

被引：1

作者：

Li, Minggang ^{[1
]}

Wei, Guoying ^{[1
]}

Wang, Jianfang ^{[1
]}

Li, Meng ^{[1
]}

Zhao, Xixi ^{[1
]}

Bai, Yuze ^{[2
]}

机构：

[1] China Jiliang Univ, Coll Mat Sci & Engn, Hangzhou 310018, Peoples R China

[2] Environm Monitoring Stn Yangquan, Yangquan, Shanxi Province, Peoples R China

来源：

SURFACE REVIEW AND LETTERS | 2014年 / 21卷 / 01期

关键词：

Bath temperature; films; electrodeposition;

D O I：

10.1142/S0218625X14500097

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

Non-cyanide alkaline bath was used to prepare copper thin films. Influences of various temperatures on deposition rates, surface morphologies and microstructures of films were investigated. Copper thin films prepared from non-cyanide alkaline bath show typical nodular structures. Copper films fabricated at higher temperature possess rough surface due to hydrolysis of complexing agents. According to the XRD patterns, all deposited films were crystalline and showed Cu (111), Cu (200) and Cu (220) peaks. The intensity of peak (200) increases gradually with the rise on bath temperatures. Films with maximum thickness (7.5 mu m) could be obtained at the temperature of 40 degrees C. From the cyclic voltammetry curve, it was found that the cathodic polarization decreased slightly with increase of bath temperatures. In addition, when the bath temperature was equal to 50 degrees C, current efficiency could reach to 96.95%.

引用

页数：7