Optimization of three-dimensional boiling enhancement structure at evaporation surface for high power light emitting diode

被引：3
作者：
Xiang, Jian-hua [1 ]
Zhou, Chao [1 ]
Zhang, Chun-liang [1 ]
Liu, Gui-yun [1 ]
Chen, Cong-gui [1 ]
Zhou, Wei [2 ]
机构：
[1] Guangzhou Univ, Sch Mech & Elect Engn, Guangzhou 510006, Guangdong, Peoples R China
[2] Xiamen Univ, Dept Mech & Elect Engn, Xiamen 361005, Peoples R China
来源：
TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA | 2018年 / 28卷 / 07期
基金：
中国国家自然科学基金;
关键词：
high power LED; phase change heat sink; ploughing-extrusion; boiling enhancement; three-dimensional microgroove; HEAT-TRANSFER; NANOFLUIDS; SINK;
D O I：
10.1016/S1003-6326(18)64779-X
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
A theoretical model of phase change heat sink was established in terms of thermal resistance network. The influence of different parameters on the thermal resistance was analyzed and the crucial impact factors were determined. Subsequently, the forming methods including ploughing-extrusion and stamping method of boiling enhancement structure at evaporation surface were investigated, upon which three-dimensional microgroove structure was fabricated to improve the efficiency of evaporation. Moreover, the crucial parameters related to the fabrication of miniaturized phase change heat sink were optimized. The heat transfer performance of the heat sink was tested. Results show that the developed phase change heat sink has excellent heat transfer performance and is suitable for high power LED applications.
引用
收藏
页码：1404 / 1412
页数：9
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