High-Frequency Analysis of Carbon Nanotube Interconnects and Implications for On-Chip Inductor Design

被引:120
|
作者
Li, Hong [1 ]
Banerjee, Kaustav [1 ]
机构
[1] Univ Calif Santa Barbara, Dept Elect & Comp Engn, Santa Barbara, CA 93106 USA
基金
美国国家科学基金会;
关键词
AC conductivity; carbon nanotube (CNT); energy storage; high-frequency; interconnect; momentum relaxation time; on-chip inductor; Q factor; skin depth; skin effect; ELECTRICAL-PROPERTIES; SPIRAL INDUCTORS; PERFORMANCE;
D O I
10.1109/TED.2009.2028395
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper presents a rigorous investigation of high-frequency effects in carbon nanotube (CNT) interconnects and their implications for the design and performance analysis of high-quality on-chip inductors. A frequency-dependent impedance extraction method is developed for both single-walled CNT (SWCNT) and multiwalled CNT (MWCNT) bundle interconnects. The method is subsequently verified by comparing the results with those derived directly from the Maxwell's equations. Our analysis reveals for the first time that skin effect in CNT (particularly MWCNT) bundles is significantly reduced compared to that in conventional metal conductors, which makes them very attractive and promising material for high-frequency applications, including high-quality (Q) factor on-chip inductor design in high-performance RF/mixed-signal circuits. It is shown that such unique high-frequency properties of CNTs essentially arise due to their large momentum relaxation time (leading to their large kinetic inductance), which causes the skin depths to saturate with frequency and thereby limits resistance increase at high frequencies in a bundle structure. It is subsequently shown that CNT-based planar spiral inductors can achieve more than three times higher Q factor than their Cu-based counterparts without using any magnetic materials or Q factor enhancement techniques.
引用
收藏
页码:2202 / 2214
页数:13
相关论文
共 50 条
  • [1] High-Frequency Effects in Carbon Nanotube Interconnects and Implications for On-Chip Inductor Design
    Li, Hong
    Banerjee, Kaustav
    IEEE INTERNATIONAL ELECTRON DEVICES MEETING 2008, TECHNICAL DIGEST, 2008, : 525 - 528
  • [2] High-Frequency Modeling of On-Chip Coupled Carbon Nanotube Interconnects for Millimeter-Wave Applications
    Zhao, Wen-Sheng
    Zheng, Jie
    Dong, Linxi
    Liang, Feng
    Hu, Yue
    Wang, Luwen
    Wang, Gaofeng
    Zhou, Qifa
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2016, 6 (08): : 1226 - 1232
  • [3] High-frequency characterization of on-chip digital interconnects
    Kleveland, B
    Qi, XN
    Madden, L
    Furusawa, T
    Dutton, RW
    Horowitz, MA
    Wong, SS
    IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2002, 37 (06) : 716 - 725
  • [4] Signal Integrity Analysis of Carbon Nanotube on-chip Interconnects
    Chiariello, A. G.
    Maffucci, A.
    Miano, G.
    2009 IEEE WORKSHOP ON SIGNAL PROPAGATION ON INTERCONNECTS, 2009, : 33 - +
  • [5] Modelling and delay analysis of on-chip differential carbon nanotube interconnects
    Cheng, Zi-Han
    Zhao, Wen-Sheng
    Wang, Da-Wei
    Wang, Jing
    Dong, Linxi
    Wang, Gaofeng
    MICRO & NANO LETTERS, 2019, 14 (05) : 505 - 510
  • [6] Effect of dummy fills on high-frequency characteristics of on-chip interconnects
    Tsuchiya, Akira
    Onodera, Hidetoshi
    10TH IEEE WORKSHOP ON SIGNAL PROPAGATION ON INTERCONNECTS, PROCEEDINGS, 2006, : 275 - +
  • [7] Frequency- and Time-Domain Analysis of High-Frequency On-Chip Interconnects with Nonuniform Conductor Edges
    Manfredi, Paolo
    Vande Ginste, Dries
    De Zutter, Daniel
    2015 IEEE 19TH WORKSHOP ON SIGNAL AND POWER INTEGRITY (SPI), 2015,
  • [8] Carbon-nanotube-based wireless on-chip interconnects
    Franck, P.
    Baillargeat, D.
    Tay, B. K.
    2016 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM (IMS), 2016,
  • [9] High-Frequency Behavior of Graphene-Based Interconnects-Part II: Impedance Analysis and Implications for Inductor Design
    Sarkar, Deblina
    Xu, Chuan
    Li, Hong
    Banerjee, Kaustav
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2011, 58 (03) : 853 - 859
  • [10] Frequency-thermal Characterization of On-Chip Single-walled Carbon Nanotube Interconnects
    Zheng, Jie
    Gao, Xuan
    Xu, Qianqian
    Zhao, Wensheng
    Wang, Gaofeng
    2015 IEEE 16TH INTERNATIONAL CONFERENCE ON COMMUNICATION TECHNOLOGY (ICCT), 2015, : 533 - 536