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[22]
Influence of Low Temperature on Tensile Properties and Fracture Behavior of Sn3Ag0.5Cu Solder Alloy
[J].
2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT),
2016,
:116-118
[28]
Deformation Behavior and Processing Parameters of Cu-3Ag-0.6Zr Alloy during Compression at Elevated Temperatures
[J].
INTERNATIONAL SYMPOSIUM ON MATERIALS APPLICATION AND ENGINEERING (SMAE 2016),
2016, 67