Very large scale integration of MOEMS mirrors, MEMS angular amplifiers and high-voltage, high-density IC electronics for photonic switching

被引：0

作者：

Bryzek, J ^{[1
]}

Nasiri, S ^{[1
]}

Flannery, A ^{[1
]}

Kwon, H ^{[1
]}

Novack, M ^{[1
]}

Marx, D ^{[1
]}

Sigari, E ^{[1
]}

Chen, E ^{[1
]}

Garate, J ^{[1
]}

机构：

[1] Transparent Networks Inc, Milpitas, CA 94539 USA

来源：

NANOTECH 2003, VOL 1 | 2003年

关键词：

MOEMS; MEMS; photonic switching; optical mirror; telecom;

D O I：

暂无

中图分类号：

R318 [生物医学工程];

学科分类号：

0831 ;

摘要：

The demand for communication bandwidth together with advances in MEMS (micro-electro-mechanical systems) technology has spurred rapid development in the field of MOEMS (micro-optical-electrical mechanical systems). One exciting opportunity is in the area of photonic switching. MOEMS mirror arrays are being used at the core of all-optical cross-connects, enabling switches that are "transparent" to network protocols, wavelengths, and bandwidth requirements. Advanced vertical integration techniques at the wafer level have been developed to enable the scalability of these arrays to support high port-count (>4096), low-cost photonic switches.

引用

页码：300 / 303

页数：4

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