Compatibility of the low-dielectric-constant poly(arylether) with the electroless copper deposition solution

Possible interactions between nonfluorinated poly(arylether) thin films and the recently developed electroless Cu deposition solution are investigated. The results show that there is no chemical reaction between this low-dielectric-constant polymer and the electroless Cu deposition solution. However, a significant change in thickness as well as refractive index is induced by the electroless solution conditions. It is demonstrated that higher temperatures can alleviate the electroless Cu solution-induced effects as far as the glass transition temperature, the coefficient of thermal expansion, and refractive index are concerned. (C) 1999 The Electrochemical Society. S0013-4651(98)08-032-X. All rights reserved.