An electromagnetic crystal power substrate with efficient suppression of power/ground plane noise on high-speed circuits

被引：7

作者：

Wu, Tzong-Lin ^{[1
]}

Chen, Sin-Ting

机构：

[1] Natl Taiwan Univ, Dept Elect Engn, Taipei 104, Taiwan

[2] Natl Taiwan Univ, Grad Inst Commun Engn, Taipei 104, Taiwan

[3] Natl Sun Yat Sen Univ, Dept Elect Engn, Kaohsiung 80424, Taiwan

来源：

IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS | 2006年 / 16卷 / 07期

关键词：

electromagnetic interference (EMI); ground bounce noise (GBN); high-speed digital circuits; photonic bandgap structure; power integrity; radiation; simultaneously switching noises (SSNs);

D O I：

10.1109/LMWC.2006.877124

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

An electromagnetic crystal power substrate (ECPS) in a high-speed circuit package is proposed for suppressing the power/ground planes noise (P/GPN) and the corresponding electromagnetic interference (EMI). The ECPS is simply realized by periodically embedding the high dielectric-constant rods into the conventional package substrate between the continuous power and ground planes. With a small number of embedded rods and low rod filling ratio, the proposed ECPS design can efficiently eliminate the noise of 30 dB in average within several designed stopbands. In addition, the radiation or EMI resulting from the P/GPN is also significantly reduced over 25 dB in the stopbands. The excellent noise and EMI suppression performance for the proposed structure are verified both experimentally and numerically. Reasonably good consistency is seen.

引用

页码：413 / 415

页数：3

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